公开(公告)号：US12128443B2

公开(公告)日：2024-10-29

申请号：US17514989

申请日：2021-10-29

申请人： KONINKLIJKE PHILIPS N.V.

发明人： Wojtek Sudol

IPC分类号： B06B1/02 ,  A61B8/00 ,  A61B8/12 ,  B81C1/00 ,  H01L23/00 ,  H01R9/05 ,  H01R12/62 ,  H01R43/20 ,  H05K3/34

CPC分类号： B06B1/0292 ,  A61B8/12 ,  A61B8/4483 ,  B06B1/02 ,  B81C1/00349 ,  H01L24/46 ,  H01R9/0515 ,  H01R12/62 ,  H01R43/205 ,  H05K3/3421 ,  H05K2201/09409 ,  H05K2201/10356 ,  Y02P70/50

摘要： An integrated circuit die is disclosed that comprises a substrate defining a plurality of circuit elements; a sensor region on the substrate, the sensor region comprising a layer stack defining a plurality of CMUT (capacitive micromachined ultrasound transducer) cells; and an interposer region on the substrate adjacent to the sensor region. The interposer region comprises a further layer stack including conductive connections to the circuit elements and the CMUT cells, the conductive connections connected to a plurality of conductive contact regions on an upper surface of the interposer region, the conductive contact regions including external contacts for contacting the integrated circuit die to a connection cable and mounting pads for mounting a passive component on the upper surface. A probe including such an integrated circuit die an ultrasound system including such a probe are also disclosed.

公开(公告)号：US12100923B2

公开(公告)日：2024-09-24

申请号：US17788501

申请日：2020-12-04

申请人： SHOWA DENKO MATERIALS CO., LTD.

发明人： Kunihiko Akai ,  Masayuki Miyaji ,  Junichi Kakehata ,  Yoshinori Ejiri ,  Toshimitsu Moriya

IPC分类号： H01R4/02 ,  H01L23/00 ,  H01R4/58 ,  H01R12/52 ,  H01R12/61 ,  H01R12/62 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36

CPC分类号： H01R4/02 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01R4/58 ,  H01R12/52 ,  H01R12/613 ,  H01R12/62 ,  H05K1/181 ,  H05K3/323 ,  H05K3/3463 ,  H05K3/3478 ,  H05K3/3494 ,  H05K3/363 ,  H05K3/368 ,  H01L2224/05644 ,  H01L2224/27003 ,  H01L2224/2711 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29499 ,  H01L2224/3201 ,  H01L2224/32145 ,  H01L2224/32227 ,  H01L2224/32505 ,  H01L2224/83201 ,  H01L2224/83444 ,  H01L2224/83815 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2224/83905 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0635 ,  H01L2924/066 ,  H01L2924/0665 ,  H01L2924/0675 ,  H01L2924/069 ,  H01L2924/07001 ,  H01L2924/07025 ,  H01L2924/0705 ,  H01L2924/0715 ,  H05K2201/10636 ,  H05K2201/10977

摘要： A connection structure including: a first circuit member having a plurality of first electrodes; a second circuit member having a plurality of second electrodes; and an intermediate layer having a plurality of bonding portions electrically connecting the first electrodes and the second electrodes, in which at least one of the first electrode and the second electrode that are connected by the bonding portion is a gold electrode, and 90% or more of the plurality of bonding portions include a first region containing a tin-gold alloy and connecting the first electrode and the second electrode and a second region containing bismuth and being in contact with the first region.

公开(公告)号：US12095185B2

公开(公告)日：2024-09-17

申请号：US17478221

申请日：2021-09-17

申请人： Apple Inc.

发明人： Lan H. Hoang ,  Takayoshi Katahira ,  Bilal Mohamed Ibrahim Kani ,  Kishore N. Renjan ,  Manoj Vadeentavida ,  Jing Tao

IPC分类号： H01R12/71 ,  H01R12/52 ,  H01R12/57 ,  H01R12/58 ,  H01R12/62 ,  H01R12/79 ,  H01R13/62 ,  H01R13/631

CPC分类号： H01R12/718 ,  H01R12/52 ,  H01R12/57 ,  H01R12/58 ,  H01R12/62 ,  H01R12/79 ,  H01R13/6205 ,  H01R13/631

摘要： Stacked circuit board structures and methods of assembly are described. In an embodiment, a stacked circuit board structure includes first circuit board and a second circuit board including a plurality of pins mounted thereon, and the plurality of pins are secured in a plurality of receptacles that are coupled with the first circuit board to provide electrical connection between the first circuit board and the second circuit board.

公开(公告)号：US20240088168A1

公开(公告)日：2024-03-14

申请号：US18515186

申请日：2023-11-20

申请人： SAMSUNG DISPLAY CO., LTD.

发明人： Tae Gyun KIM ,  Jun Hong PARK ,  Eui Suk JUNG

IPC分类号： H01L27/12 ,  H01R12/62

CPC分类号： H01L27/124 ,  H01L27/1259 ,  H01R12/62

摘要： A display device includes: a first substrate; a second substrate on the first substrate and exposing a first edge portion of the first substrate, the second substrate protruding beyond a second edge portion of the first substrate; a connection line on the first edge portion of the first substrate, the connection line having a first end portion protruding beyond a first side of the second substrate and a second end portion covered by the second substrate; and a thin-film transistor layer on the second substrate and connected to the connection line. The thin-film transistor layer includes signal lines extending from the first side to a second side of the second substrate. The signal lines extend into contact openings in the thin-film transistor layer and are exposed at a lower part of the second substrate on the second side of the second substrate.

公开(公告)号：US20240039190A1

公开(公告)日：2024-02-01

申请号：US18361611

申请日：2023-07-28

申请人： AVATION MEDICAL, INC.

发明人： Austin Morgan ,  David DeMuth ,  Manish Vaishya

IPC分类号： H01R12/62 ,  H01R4/06 ,  H05K1/11 ,  H05K1/14 ,  A61N1/04

CPC分类号： H01R12/62 ,  H01R4/06 ,  H05K1/116 ,  H05K1/144 ,  A61N1/0484 ,  A61N1/0456 ,  H05K2201/042 ,  H01R4/48

摘要： A wearable neurostimulator includes a fabric structure, a flexible circuit printed on the fabric structure with exposed electrically conductive portions, and a rigid PCB including an electrical circuit and exposed electrically conductive portions. A rivet includes a shank that extends through the fabric structure, conductive pads, PCB, and conductive vias. The rivet electrically connects the conductive portions of the PCB circuit to the conductive portions of the flexible circuit.

公开(公告)号：US11864457B2

公开(公告)日：2024-01-02

申请号：US18160410

申请日：2023-01-27

申请人： Japan Display Inc.

发明人： Masumi Nishimura

IPC分类号： H10K77/10 ,  H10K50/84 ,  H10K50/805 ,  H10K50/814 ,  H10K50/824 ,  H10K50/844 ,  H10K59/122 ,  H10K59/125 ,  H10K59/131 ,  H01R12/62 ,  H10K102/00

CPC分类号： H10K77/111 ,  H01R12/62 ,  H10K50/805 ,  H10K50/814 ,  H10K50/824 ,  H10K50/84 ,  H10K50/844 ,  H10K59/122 ,  H10K59/125 ,  H10K59/131 ,  H10K2102/00 ,  H10K2102/311 ,  H10K2102/351 ,  Y02E10/549

摘要： In a display device including a flexible display panel, the risk of disconnection of a wiring due to bending is reduced. A display panel includes a display function layer including display elements and a wiring on one major surface of a base material having flexibility. The display panel includes, on the one major surface of the base material, an organic-film-covered wiring area where the surface of the wiring is covered with an organic planarization film that is an organic insulating film in direct contact with the wiring. The display panel includes, in the plane thereof, a display area where the display elements are arranged and a component mounting area that is a peripheral area located outside the display area. As the organic-film-covered wiring area, a curved area is provided in the peripheral area.

公开(公告)号：US11825605B2

公开(公告)日：2023-11-21

申请号：US16649427

申请日：2018-07-24

申请人： Sensor Holdings Limited

发明人： Todd Alan Gisby ,  Llewellyn Adair Sims Johns ,  Andrew Thomas Wong ,  Felix Qing-Song Lun ,  Paul Malcolm Guininbert ,  Jeremy Labrado ,  Lewis Freeth Harpham ,  Elodie Lyath Bouzbib

IPC分类号： H05K1/18 ,  H05K1/14 ,  H01R12/70 ,  H01R12/62 ,  H01R12/79 ,  H01R43/00 ,  H05K3/32 ,  G01D5/24 ,  G01L1/14

CPC分类号： H05K1/18 ,  G01D5/24 ,  G01L1/142 ,  H01R12/62 ,  H01R12/7076 ,  H01R12/79 ,  H01R43/00 ,  H05K1/147 ,  H05K3/321 ,  H05K3/326 ,  H05K2201/10151

摘要： One aspect of the invention provides an interconnect between a stretchable electronic element and a circuit on a rigid or flexible printed circuit board (PCB Circuit), the stretchable electronic element is operable to be mechanically coupled to a substrate which deforms, and the stretchable electronic element will deform with the substrate and may or may not change an electrical characteristic as a result, the stretchable electronic element comprising one or more electrical pathways; the PCB Circuit configured to communicate electronically with the stretchable electronic element and comprising at least one circuit board extending from the stretchable electronic element to an electrical circuit on the PCB Circuit; wherein the interconnect comprises an electrical coupling between the electrical pathways of the stretchable electronic element and the PCB Circuit; and wherein the interconnect simultaneously prevents the connection between the stretchable electronic element from failing when the stretchable substrate is stretched in normal operation, minimizes the bulk of support material required to support the interconnect, and minimizes any reduction in the stretch capabilities of the stretchable substrate.

公开(公告)号：US11710914B2

公开(公告)日：2023-07-25

申请号：US16849474

申请日：2020-04-15

申请人： FUJITSU OPTICAL COMPONENTS LIMITED

发明人： Tomonori Azuma ,  Tetsuo Ishizaka ,  Koji Otsubo

IPC分类号： G02B6/42 ,  H01R12/52 ,  H01R12/62

CPC分类号： H01R12/52 ,  G02B6/4269 ,  G02B6/4281 ,  H01R12/62

摘要： An optical module includes: a first board having an optical component bonded thereto with an adhesive; a connection structure part rising from the first board and made of a material having lower thermal conductivity than thermal conductivity of a material of the first board; and a second board joined to the connection structure part.

公开(公告)号：US20230172041A1

公开(公告)日：2023-06-01

申请号：US18160410

申请日：2023-01-27

申请人： Japan Display Inc.

发明人： Masumi NISHIMURA

IPC分类号： H10K77/10 ,  H10K50/84 ,  H10K50/805 ,  H10K50/814 ,  H10K50/824 ,  H10K50/844 ,  H10K59/122 ,  H10K59/125 ,  H10K59/131 ,  H01R12/62

CPC分类号： H10K77/111 ,  H10K50/84 ,  H10K50/805 ,  H10K50/814 ,  H10K50/824 ,  H10K50/844 ,  H10K59/122 ,  H10K59/125 ,  H10K59/131 ,  H01R12/62 ,  Y02E10/549 ,  H10K2102/00

摘要： In a display device including a flexible display panel, the risk of disconnection of a wiring due to bending is reduced. A display panel includes a display function layer including display elements and a wiring on one major surface of a base material having flexibility. The display panel includes, on the one major surface of the base material, an organic-film-covered wiring area where the surface of the wiring is covered with an organic planarization film that is an organic insulating film in direct contact with the wiring. The display panel includes, in the plane thereof, a display area where the display elements are arranged and a component mounting area that is a peripheral area located outside the display area. As the organic-film-covered wiring area, a curved area is provided in the peripheral area.

公开(公告)号：US11644702B2

公开(公告)日：2023-05-09

申请号：US17744799

申请日：2022-05-16

申请人： Japan Display Inc.

发明人： Ikuo Matsunaga

IPC分类号： G02F1/1333 ,  G02F1/1362 ,  G02F1/13357 ,  H01L27/32 ,  H01L51/00 ,  H01L51/52 ,  H01R12/62 ,  H05K3/36

CPC分类号： G02F1/133345 ,  G02F1/133305 ,  G02F1/133603 ,  G02F1/136213 ,  H01L27/3246 ,  H01L51/0097 ,  H01L51/5203 ,  H01L2251/5338 ,  H01R12/62 ,  H05K3/361 ,  H05K2201/09145 ,  Y02E10/549

摘要： A display device includes a base film including a first region and a plurality of second regions having the first region therebetween; an inorganic insulating film on the base film, the inorganic insulating film being in contact with the plurality of second regions of the base film; a plurality of first pixels overlapping the first region; and a plurality of second pixels overlapping the plurality of second regions with the inorganic insulating film being between the plurality of second pixels and the plurality of second regions. The inorganic insulating film is divided by the first region and is discontinuous between the plurality of second regions.