公开(公告)号：US20090052842A1

公开(公告)日：2009-02-26

申请号：US11895011

申请日：2007-08-22

申请人： Franz Draxler ,  Klaus Hartkorn ,  Markus Meinelt ,  Angela Rief ,  Wolfgang Schweiker

发明人： Franz Draxler ,  Klaus Hartkorn ,  Markus Meinelt ,  Angela Rief ,  Wolfgang Schweiker

IPC分类号： G02B6/26 ,  B32B37/12

CPC分类号： B32B37/12 ,  B32B2305/342 ,  B32B2310/0831 ,  B32B2551/00 ,  G02B6/30 ,  G02B6/3636 ,  G02B6/3652 ,  G02B2006/1215

摘要： An optical splitter has an optical chip, in which a conductor track is arranged on a carrier substrate, wherein a conductor track section of the conductor track running from a first side of the chip branches into different conductor track sections which run to a second side of the chip via a plurality of branching nodes. An optical waveguide section of an optical waveguide is bonded at the first side of the chip by means of an adhesive material. Correspondingly, optical waveguide sections are bonded on the second side of the chip by means of an adhesive material. In order to reinforce the fixing, glass plates are arranged over and under the optical waveguides, said glass plates being bonded to the optical chip at the respective lateral surfaces.

公开(公告)号：US07555176B2

公开(公告)日：2009-06-30

申请号：US11895011

申请日：2007-08-22

申请人： Franz Draxler ,  Klaus Hartkorn ,  Markus Meinelt ,  Angela Rief ,  Wolfgang Schweiker

发明人： Franz Draxler ,  Klaus Hartkorn ,  Markus Meinelt ,  Angela Rief ,  Wolfgang Schweiker

IPC分类号： G02B6/26

CPC分类号： B32B37/12 ,  B32B2305/342 ,  B32B2310/0831 ,  B32B2551/00 ,  G02B6/30 ,  G02B6/3636 ,  G02B6/3652 ,  G02B2006/1215

摘要： An optical splitter has an optical chip, in which a conductor track is arranged on a carrier substrate, wherein a conductor track section of the conductor track running from a first side of the chip branches into different conductor track sections which run to a second side of the chip via a plurality of branching nodes. An optical waveguide section of an optical waveguide is bonded at the first side of the chip by means of an adhesive material. Correspondingly, optical waveguide sections are bonded on the second side of the chip by means of an adhesive material. In order to reinforce the fixing, glass plates are arranged over and under the optical waveguides, said glass plates being bonded to the optical chip at the respective lateral surfaces.

摘要翻译： 光分路器具有其中导体轨道布置在载体基板上的光学芯片，其中从芯片的第一侧延伸的导体轨道的导体轨道部分分支到不同的导体轨道部分，该导体轨道部分运行到 该芯片经由多个分支节点。 光波导的光波导部分通过粘合材料在芯片的第一侧接合。 相应地，光波导部分通过粘合材料结合在芯片的第二侧上。 为了加强固定，玻璃板布置在光波导上方和下方，所述玻璃板在相应的侧表面处结合到光学芯片。