公开(公告)号：US07044836B2

公开(公告)日：2006-05-16

申请号：US10419580

申请日：2003-04-21

申请人： Fred F. Sun ,  Bin Lu ,  Ethan K. Lightle ,  Shumin Wang

发明人： Fred F. Sun ,  Bin Lu ,  Ethan K. Lightle ,  Shumin Wang

IPC分类号： B24B1/00

CPC分类号： C09G1/02 ,  C09K3/1463 ,  H01L21/3212

摘要： The invention provides a method of polishing a substrate, which method comprises the steps of (i) providing a polishing composition, (ii) providing a substrate comprising at least one metal layer, and (iii) abrading at least a portion of the metal layer with the polishing composition to polish the substrate. The polishing composition comprises an abrasive and a liquid carrier, wherein the abrasive comprises metal oxide particles having a surface with a silane compound adhered to a portion thereof and a polymer adhered to the silane compound and wherein the polymer is selected from the group consisting of water-soluble polymers and water-emulsifiable polymers. The invention also provides a polishing composition as described above, wherein the total amount of abrasive particles present in the polishing composition is no greater than about 20% by weight of the polishing composition, and the metal oxide particles do not comprise zirconia.

摘要翻译： 本发明提供一种抛光基材的方法，该方法包括以下步骤：（i）提供抛光组合物，（ii）提供包括至少一个金属层的基材，和（iii）研磨金属层的至少一部分 用抛光组合物抛光底物。 抛光组合物包括研磨剂和液体载体，其中磨料包含金属氧化物颗粒，其表面具有粘附到其一部分上的硅烷化合物，和聚合物粘附到硅烷化合物上，并且其中聚合物选自水 可溶性聚合物和水可乳化聚合物。 本发明还提供了如上所述的抛光组合物，其中存在于抛光组合物中的磨料颗粒的总量不大于抛光组合物的约20重量％，并且金属氧化物颗粒不包含氧化锆。