Enhanced n-type silicon material for epitaxial wafer substrate and method of making same
    1.
    发明授权
    Enhanced n-type silicon material for epitaxial wafer substrate and method of making same 有权
    用于外延晶片衬底的增强型n型硅材料及其制造方法

    公开(公告)号:US06491752B1

    公开(公告)日:2002-12-10

    申请号:US09354994

    申请日:1999-07-16

    IPC分类号: H01L21228

    CPC分类号: C30B29/06 C30B15/04

    摘要: An enhanced n+ silicon material for epitaxial substrates and a method for producing it are described. The enhanced material leads to improved gettering characteristics of n/n+ epitaxial wafers based on these substrates. The method for preparing such n+ silicon material includes applying a co-doping of carbon to the usual n dopant in the silicon melt, before growing respective CZ crystals. This improves yield of enhanced n+ silicon material in crystal growing and ultimately leads to device yield stabilization or improvement when such n/n+ epitaxial wafers are applied in device manufacturing.

    摘要翻译: 描述了用于外延衬底的增强的n +硅材料及其制造方法。 增强的材料导致基于这些衬底的n / n +外延晶片的改善的吸杂特性。 制备这种n +硅材料的方法包括在生长各自的CZ晶体之前,将碳共掺杂到硅熔体中的通常的n掺杂剂中。 这提高了晶体生长中增强的n +硅材料的产率,并且当这种n / n +外延晶片应用于器件制造时,最终导致器件产量稳定或改进。