公开(公告)号：US20090102005A1

公开(公告)日：2009-04-23

申请号：US11976058

申请日：2007-10-19

申请人： Fu-Tien Weng ,  Yung-Shun Liao ,  Yi-Chuan Lo ,  Bii-Cheng Chang

发明人： Fu-Tien Weng ,  Yung-Shun Liao ,  Yi-Chuan Lo ,  Bii-Cheng Chang

IPC分类号： H01L31/0203 ,  G03F1/00

CPC分类号： H01L27/14618 ,  H01L23/10 ,  H01L27/14683 ,  H01L2924/0002 ,  H01L2924/00

摘要： An exemplary wafer level package comprises a semiconductor wafer with a plurality of semiconductor chips of perfect polygonal shapes thereon. A circuit-free area is defined over the semiconductor wafer to electrically isolate the semiconductor chips. A dam structure is substantially formed over the circuit-free area, wherein a portion of the dam structure formed around an edge of the semiconductor wafer is formed with a plurality via holes therein. A transparent substrate is formed over the semiconductor wafer, defining a plurality of cavities between the semiconductor chips and the transparent substrate, wherein the transparent substrate is supported by the dam structure.

摘要翻译： 示例性晶片级封装包括其上具有多个完美多边形形状的多个半导体芯片的半导体晶片。 在半导体晶片上限定无电路区域以电绝缘半导体芯片。 大坝结构基本上形成在无电路区域上，其中围绕半导体晶片的边缘形成的坝结构的一部分在其中形成有多个通孔。 在半导体晶片之上形成透明基板，在半导体芯片和透明基板之间限定多个空腔，其中透明基板由坝结构支撑。

公开(公告)号：US09117714B2

公开(公告)日：2015-08-25

申请号：US11976058

申请日：2007-10-19

申请人： Fu-Tien Weng ,  Yung-Shun Liao ,  Yi-Chuan Lo ,  Bii-Cheng Chang

发明人： Fu-Tien Weng ,  Yung-Shun Liao ,  Yi-Chuan Lo ,  Bii-Cheng Chang

IPC分类号： H01L27/00 ,  H01L27/146 ,  H01L23/10

CPC分类号： H01L27/14618 ,  H01L23/10 ,  H01L27/14683 ,  H01L2924/0002 ,  H01L2924/00

摘要： An exemplary wafer level package comprises a semiconductor wafer with a plurality of semiconductor chips of perfect polygonal shapes thereon. A circuit-free area is defined over the semiconductor wafer to electrically isolate the semiconductor chips. A dam structure is substantially formed over the circuit-free area, wherein a portion of the dam structure formed around an edge of the semiconductor wafer is formed with a plurality via holes therein. A transparent substrate is formed over the semiconductor wafer, defining a plurality of cavities between the semiconductor chips and the transparent substrate, wherein the transparent substrate is supported by the dam structure.

公开(公告)号：US07812302B2

公开(公告)日：2010-10-12

申请号：US12288257

申请日：2008-10-17

申请人： Chin-Chen Kuo ,  Wu-Chieh Liu ,  Hsiao-Wen Lee ,  Bii-Cheng Chang

发明人： Chin-Chen Kuo ,  Wu-Chieh Liu ,  Hsiao-Wen Lee ,  Bii-Cheng Chang

IPC分类号： H01L27/00

CPC分类号： H01L27/14627 ,  H01L27/14603 ,  H01L27/14685

摘要： The present invention provides an image sensor which comprises improved microlenses to cope with different optical requirements for oblique incident light or different components of light. In one embodiment, the image sensor comprises at least two microlenses having different radii of curvature. In another embodiment, the image sensor comprises at least one asymmetrical microlens.

摘要翻译： 本发明提供了一种图像传感器，其包括改进的微透镜以应对对于倾斜入射光或不同光分量的不同光学要求。 在一个实施例中，图像传感器包括具有不同曲率半径的至少两个微透镜。 在另一个实施例中，图像传感器包括至少一个非对称微透镜。

公开(公告)号：US20080011936A1

公开(公告)日：2008-01-17

申请号：US11485676

申请日：2006-07-14

申请人： Chin-Chen Kuo ,  Wu-Chieh Liu ,  Hsiao-Wen Lee ,  Bii-Cheng Chang

发明人： Chin-Chen Kuo ,  Wu-Chieh Liu ,  Hsiao-Wen Lee ,  Bii-Cheng Chang

IPC分类号： H01L27/00

CPC分类号： H01L27/14627 ,  H01L27/14603 ,  H01L27/14685

摘要： The present invention provides an image sensor which comprises improved microlenses to cope with different optical requirements for oblique incident light or different components of light. In one embodiment, the image sensor comprises at least two microlenses having different radii of curvature. In another embodiment, the image sensor comprises at least one asymmetrical microlens.

摘要翻译： 本发明提供了一种图像传感器，其包括改进的微透镜以应对对于倾斜入射光或不同光分量的不同光学要求。 在一个实施例中，图像传感器包括具有不同曲率半径的至少两个微透镜。 在另一个实施例中，图像传感器包括至少一个非对称微透镜。

公开(公告)号：US06274917B1

公开(公告)日：2001-08-14

申请号：US09693505

申请日：2000-10-23

申请人： Yang-Tung Fan ,  Sheng-Liang Pan ,  Bii-Cheng Chang ,  Kuo-Liang Lu

发明人： Yang-Tung Fan ,  Sheng-Liang Pan ,  Bii-Cheng Chang ,  Kuo-Liang Lu

IPC分类号： H01L310232

CPC分类号： H01L27/14609 ,  H01L27/14621 ,  H01L27/14627

摘要： A microelectronic method is described for optimizing the fabrication of optical and semiconductor array structures for high efficiency color image formation in solid-state cameras. Disclosed is an ordered fabrication sequence in which microlens formation precedes color filter layer formation to enable increased image light collection efficiency, to encapsulate and protect the microlens elements from chemical and thermal processing damage, to minimize topographical underlayer variations which would axially misalign or otherwise aberrate microlens elements formed on non-planar surfaces, and, to complete the most difficult steps early in the process to minimize rework and scrap. A CMOS, CID, or CCD optoelectronic configuration is formed by photolithographically patterning a planar-array of photodiodes on a Silicon or other III-V, II-VI, or compound semiconductor substrate. The photodiode array is provided with metal photoshields, passivated, planarized, and, a first convex microlens array of high curvature or other suitable lenses are formed thereon. A transparent encapsulant is deposited to planarize the microlens layer and provide a spacer for the successive deposition(s) of one or more color filter layers. The microlens array may be formed from positive photoresists and the spacer from negative resist, with close attention to matching the index of refraction at layer interfaces. A final surface layer comprising a color filter completes the solid-state color image-forming device.

公开(公告)号：US20090078855A1

公开(公告)日：2009-03-26

申请号：US12288257

申请日：2008-10-17

申请人： Chin-Chen Kuo ,  Wu-Chieh Liu ,  Hsiao-Wen Lee ,  Bii-Cheng Chang

发明人： Chin-Chen Kuo ,  Wu-Chieh Liu ,  Hsiao-Wen Lee ,  Bii-Cheng Chang

IPC分类号： H01L27/00

CPC分类号： H01L27/14627 ,  H01L27/14603 ,  H01L27/14685

摘要： The present invention provides an image sensor which comprises improved microlenses to cope with different optical requirements for oblique incident light or different components of light. In one embodiment, the image sensor comprises at least two microlenses having different radii of curvature. In another embodiment, the image sensor comprises at least one asymmetrical microlens.

摘要翻译： 本发明提供了一种图像传感器，其包括改进的微透镜以应对对于倾斜入射光或不同光分量的不同光学要求。 在一个实施例中，图像传感器包括具有不同曲率半径的至少两个微透镜。 在另一个实施例中，图像传感器包括至少一个非对称微透镜。

公开(公告)号：US06495813B1

公开(公告)日：2002-12-17

申请号：US09414926

申请日：1999-10-12

申请人： Yang-Tung Fan ,  Bii-Cheng Chang ,  Sheng-Liang Pan ,  Kuo-Liang Lu

发明人： Yang-Tung Fan ,  Bii-Cheng Chang ,  Sheng-Liang Pan ,  Kuo-Liang Lu

IPC分类号： H01L2700

CPC分类号： H01L27/14603 ,  H01L27/14627

摘要： Multi-microlens arrays for optimizing light collection efficiency in CCD/CMOS solid-state color image cameras with L-shaped or non-regular photodetector areas are disclosed. Microelectronic fabrication methods for forming planar array multi-microlenses comprised of elements consisting of lens-pairs, integrated with color-filters, and compatible with CMOS high-volume manufacturing are taught. Experimental results demonstrating the processes for fabrication of multi-microlenses for L-shaped and for non-regular sensing areas are given.

摘要翻译： 公开了用于优化具有L形或非常规光电探测器区域的CCD / CMOS固态彩色摄像机中的光收集效率的多微透镜阵列。 教导了用于形成平面阵列多微透镜的微电子制造方法，所述平面阵列多微透镜由与彩色滤光片集成并与CMOS大批量制造兼容的透镜对构成的元件组成。 给出了证明L型和非常规感测区域的多微透镜制造工艺的实验结果。

公开(公告)号：US06171885B2

公开(公告)日：2001-01-09

申请号：US09414925

申请日：1999-10-12

申请人： Yang-Tung Fan ,  Sheng-Liang Pan ,  Bii-Cheng Chang ,  Kuo-Liang Lu

发明人： Yang-Tung Fan ,  Sheng-Liang Pan ,  Bii-Cheng Chang ,  Kuo-Liang Lu

IPC分类号： H01L21339

CPC分类号： H01L27/14609 ,  H01L27/14621 ,  H01L27/14627

摘要： A microelectronic method is described for optimizing the fabrication of optical and semiconductor array structures for high efficiency color image formation in solid-state cameras. Disclosed is an ordered fabrication sequence in which microlens formation precedes color filter layer formation to enable increased image light collection efficiency, to encapsulate and protect the microlens elements from chemical and thermal processing damage, to minimize topographical underlayer variations which would axially misalign or otherwise aberrate microlens elements formed on non-planar surfaces, and, to complete the most difficult steps early in the process to minimize rework and scrap. A CMOS, CID, or CCD optoelectronic configuration is formed by photolithographically patterning a planar-array of photodiodes on a Silicon or other III-V, II-VI, or compound semiconductor substrate. The photodiode array is provided with metal photoshields, passivated, planarized, and, a first convex microlens array of high curvature or other suitable lenses are formed thereon. A transparent encapsulant is deposited to planarize the microlens layer and provide a spacer for the successive deposition(s) of one or more color filter layers. The microlens array may be formed from positive photoresists and the spacer from negative resist, with close attention to matching the index of refraction at layer interfaces. A final surface layer comprising a color filter completes the solid-state color image-forming device.

摘要翻译： 描述了用于优化固态照相机中用于高效率彩色图像形成的光学和半导体阵列结构的制造的微电子方法。 公开了一种有序的制造顺序，其中微透镜形成在滤色器层形成之前，以提高图像光采集效率，封装和保护微透镜元件免受化学和热处理损伤，以最小化将轴向不对准或以其他方式将微透镜像差的形貌底层变化 在非平面表面上形成的元件，并且在过程的早期完成最困难的步骤，以最小化返工和废料。 通过光刻地图案化硅或其它III-V，II-VI或化合物半导体衬底上的光电二极管平面阵列来形成CMOS，CID或CCD光电结构。 光电二极管阵列设置有金属遮光罩，钝化，平面化，并且在其上形成高曲率的第一凸形微透镜阵列或其它合适的透镜。 沉积透明的密封剂以使微透镜层平坦化，并为一个或多个滤色器层的连续沉积提供间隔物。 微透镜阵列可以由正光致抗蚀剂和来自负光刻胶的间隔物形成，密切关注层界面处的折射率的匹配。 包括滤色器的最终表面层完成了固态彩色图像形成装置。