公开(公告)号：US20020090589A1

公开(公告)日：2002-07-11

申请号：US10038262

申请日：2002-01-03

Applicant: Fujikoshi Machinery Corp.

Inventor： Tetsuro Toya

IPC: F27D005/00 ,  B65D085/48

CPC classification number: C30B25/12 ,  F27D2003/0002

Abstract: The method of the present invention is capable of adhering a wafer to a prescribed position of the carrier plate, which has been correctly positioned, in a short time. The method comprises the steps of: heating a carrier plate; detecting a mark provided to a predetermined position of the carrier plate rotating at predetermined rotational speed; positioning the carrier plate on the basis of a position of the detected mark; conveying the carrier plate to a wafer adhering section with keeping a posture of the carrier plate which has been positioned in the positioning step; and adhering the wafer at a prescribed position of the carrier plate.

Abstract translation: 本发明的方法能够在短时间内将晶片粘贴到正确定位的载板的规定位置。 该方法包括以下步骤：加热载板; 检测提供给以预定转速旋转的所述承载板的预定位置的标记; 基于检测到的标记的位置来定位承载板; 将承载板传送到晶片粘附部分，同时保持已经定位在定位步骤中的承载板的姿势; 并将晶片粘附在载体板的规定位置。