公开(公告)号：US20240399529A1

公开(公告)日：2024-12-05

申请号：US18724971

申请日：2023-04-03

Applicant: Fujikoshi Machinery Corp.

Inventor： Yuya KANNO

IPC: B24B37/04

Abstract: An object is to provide a polishing apparatus and a polishing method with which surface modification is implemented on a workpiece surface in consideration of the distribution of recesses and protrusions on the workpiece surface and with short-time processability improved. As a solution, a polishing apparatus (10) polishes a workpiece (W) under the following requirements. The polishing apparatus (10) includes a cavitation generating emission device (50). The cavitation generating emission device (50) has an inner tube (54) in which a first liquid flow (A) flows. The inner tube (54) includes a cavitation generating unit (54a). The cavitation generating emission device (50) is configured to generate cavitation in the first liquid flow (A) and make the first liquid flow (A) collide with the workpiece (W).