公开(公告)号：US20240389478A1

公开(公告)日：2024-11-21

申请号：US18784252

申请日：2024-07-25

Applicant: Fujitsu Limited

Inventor： Masatoshi TAKENOUCHI ,  Norinao KOUMA ,  Takeaki SHIMANOUCHI ,  Tsuyoshi TAKAHASHI

IPC: H10N60/81 ,  G06N10/20 ,  G06N10/40 ,  H10N60/01 ,  H10N69/00

Abstract: An electronic device including: a bump that includes a tapered protrusion and a tapered conductive film, the tapered protrusion including a base material of a substrate and of which an area of a cross section that intersects with a normal direction of the substrate is gradually reduced toward a front end, the tapered conductive film being a part of the bump that covers a surface of the protrusion and reflects a shape of the protrusion.