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1.发明申请公开(公告)号：US20030095888A1
公开(公告)日：2003-05-22
申请号：US10291572
申请日：2002-11-12
Applicant: Fujitsu Limited
Inventor： Masayuki Kitajima , Masakazu Takesue , Yasuo Moriya , Yoshinori Nemoto , Yumiko Fukushima
IPC: C22C013/02
CPC classification number: B23K35/025 , B23K35/262 , B23K35/264 , B23K35/3613 , B23K35/3615 , B23K35/3616 , B23K35/3618 , H05K3/3463
Abstract: A lead-free solder alloy composition containing Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.
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2.发明申请Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy 失效无铅焊料合金以及使用这种无铅焊料合金的电气和电子设备的制造过程公开(公告)号：US20040052678A1
公开(公告)日：2004-03-18
申请号：US10337373
申请日：2003-01-07
Applicant: Fujitsu Limited
Inventor： Masakazu Takesue , Yasuo Moriya , Yoshinori Nemoto , Yumiko Fukushima
IPC: C22C013/02
CPC classification number: B23K35/025 , B23K35/262 , B23K35/264 , B23K35/3613 , B23K35/3615 , B23K35/3616 , B23K35/3618 , H05K3/3463
Abstract: A lead-free solder powder that can include a plurality of lead-free solder particles each having a general spherical shape with a diameter of 20-60 nullm. Each of the lead-free solder particles can contain Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.
Abstract translation: 一种无铅焊料粉末，其可以包括多个直径为20-60μm的一般球形的无铅焊料颗粒。 每个无铅焊料颗粒可以含有Sn，Ag和Bi，其各自的浓度设定为使得无铅焊料合金的熔融温度低于要焊接的工件的预定耐热温度。
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3.发明申请Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy 失效无铅焊料合金以及使用这种无铅焊料合金的电气和电子设备的制造过程公开(公告)号：US20010001990A1
公开(公告)日：2001-05-31
申请号：US09728120
申请日：2000-12-04
Applicant: Fujitsu Limited
Inventor： Masayuki Kitajima , Masakazu Takesue , Yasuo Moriya , Yoshinori Nemoto , Yumiko Fukushima
IPC: H05K003/34
CPC classification number: B23K35/025 , B23K35/262 , B23K35/264 , B23K35/3613 , B23K35/3615 , B23K35/3616 , B23K35/3618 , H05K3/3463
Abstract: A lead-free solder alloy composition containing Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.
Abstract translation: 含有Sn，Ag和Bi的无铅焊料合金组合物，各自的浓度设定为使得无铅焊料合金的熔融温度低于要焊接的工件的预定耐热温度。
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