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    Method of assembling micro-actuator
    1.
    发明申请
    Method of assembling micro-actuator 失效
    组合微致动器的方法

    公开(公告)号：US20020059717A1

    公开(公告)日：2002-05-23

    申请号：US09820553

    申请日：2001-03-29

    Applicant: FUJITSU LIMITED

    Inventor： Toru Okada ,  Kenji Iketaki ,  Hidehiko Kobayashi ,  Yutaka Noda ,  Masayuki Kitajima ,  Seiichi Shimoura ,  Masakazu Takesue ,  Keiichi Yamamoto ,  Hisao Tanaka ,  Masanao Fujii

    IPC: G11B005/127 ,  H04R031/00

    CPC classification number: G11B5/5552 ,  H01L41/313 ,  Y10T29/42 ,  Y10T29/49025 ,  Y10T29/49055

    Abstract: A method of assembling a micro-actuator is provided in which a base frame having a plurality of actuator bases is placed on a stage, a first adhesive is applied to each of the actuator bases, and a base electrode frame having a plurality of base electrodes is placed on the first adhesive. The first adhesive is semi-cured by heating and pressing. A second adhesive is applied to each of the base electrodes, and a plurality of piezoelectric elements are placed on the second adhesive. The second adhesive is semi-cured by heating and pressing. A third adhesive is applied to the piezoelectric elements, and a movable electrode frame having a plurality of movable electrodes is placed on the third adhesive. The third adhesive is semi-cured by heating and pressing. Next, a fourth adhesive is applied to each of the movable electrodes, and a hinge plate frame having a plurality of hinge plates is placed on the fourth adhesive. The fourth adhesive is semi-cured by heating and pressing. Finally, the adhered laminate thus obtained is placed in a heating furnace, and is heated at a predetermined temperature for a predetermined period of time, whereby each of the adhesives is fully cured.

    Abstract translation: 提供了一种组装微致动器的方法，其中具有多个致动器基座的基架被放置在台架上，第一粘合剂被施加到每个致动器基座，以及具有多个基极的基极框架 被放置在第一粘合剂上。 第一粘合剂通过加热和压制半固化。 将第二粘合剂施加到每个基底电极上，并且将多个压电元件放置在第二粘合剂上。 第二粘合剂通过加热和压制半固化。 将第三粘合剂施加到压电元件，并且具有多个可移动电极的可动电极框架被放置在第三粘合剂上。 第三粘合剂通过加热和压制半固化。 接下来，将第四粘合剂施加到每个可移动电极，并且具有多个铰链板的铰链板框架放置在第四粘合剂上。 第四粘合剂通过加热和加压半固化。 最后，将如此获得的粘合层压材料放置在加热炉中，并在预定温度下加热预定的时间，从而使各种粘合剂完全固化。

    Solder alloy and soldered bond
    3.
    发明申请
    Solder alloy and soldered bond 有权
    焊接合金和焊接焊接

    公开(公告)号：US20030143104A1

    公开(公告)日：2003-07-31

    申请号：US10356546

    申请日：2003-02-03

    Applicant: FUJITSU LIMITED

    Inventor： Masayuki Kitajima ,  Tadaaki Shono ,  Masakazu Takesue ,  Yutaka Noda

    IPC: C22C013/00

    CPC classification number: B23K35/262 ,  B23K35/025 ,  B23K2101/36 ,  H05K3/3463

    Abstract: A solder alloy having a solderability comparable to that of a conventional PbnullSn solder alloy without having a detrimental effect on the environment and a soldered bond using the same. A solder alloy consisting of Zn: 4.0-10.0 wt %, In: 1.0 to 15.0 wt %, Al: 0.0020 to 0.0100 wt %, and the balance of Sn and unavoidable impurities. A soldered bond of an electric or electronic device composed of the above solder alloy.

    Abstract translation: 具有与常规Pb-Sn焊料合金相当的可焊性的焊料合金，而不会对环境产生不利影响，并且使用焊料合金。 由Zn：4.0〜10.0重量％，In：1.0〜15.0重量％，Al：0.0020〜0.0100重量％，Sn和不可避免的杂质构成的焊料合金。 由上述焊料合金构成的电气或电子设备的焊接结合体。

    Soldering method and soldered joint
    5.
    发明申请
    Soldering method and soldered joint 有权
    焊接方法和焊接接头

    公开(公告)号：US20020018844A1

    公开(公告)日：2002-02-14

    申请号：US09930245

    申请日：2001-08-16

    Applicant: Fujitsu Limited

    Inventor： Masayuki Kitajima ,  Masakazu Takesue ,  Tadaaki Shono ,  Motoko Fujioka

    IPC: B05D005/12 ,  B23K020/16 ,  B23K035/24 ,  B23K035/36

    CPC classification number: B23K35/262 ,  B23K1/002 ,  B23K1/20 ,  H05K3/282 ,  H05K3/3463 ,  Y10T428/12903

    Abstract: The present invention provides a soldering method and a soldered joint securing a strength of joint equivalent to soldering using a conventional PbnullSn solder alloy without having a detrimental effect on the environment and without causing a rise in cost. A soldering method comprising a step of covering Cu electrodes of electronic equipment by a rust-proofing coating consisting of an organic compound including N and a step of forming soldered joints on the covered Cu electrodes, by using a solder material consisting of at least 2.0 wt % and less than 3 wt % of Ag, 0.5 to 0.8 wt % of Cu, and a balance of Sn and unavoidable impurities. The solder material used in the present invention further contains not more than 3 wt % in total of at least one element selected from the group consisting of Sb, In, Au, Zn, Bi, and Al.

    Abstract translation: 本发明提供焊接方法和焊接接头，其使用常规的Pb-Sn焊料合金确保焊接强度，而不会对环境产生不利影响，而不会导致成本上升。 一种焊接方法，包括通过使用由包含N的有机化合物构成的防锈涂层和在覆盖的Cu电极上形成焊接接头的步骤来覆盖电子设备的Cu电极的步骤，通过使用由至少2.0wt ％且小于3重量％的Ag，0.5〜0.8重量％的Cu，余量为Sn和不可避免的杂质。 本发明中使用的焊料材料还含有不超过3重量％的选自Sb，In，Au，Zn，Bi和Al中的至少一种元素。

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