Polishing mechanism, polishing device, and polishing method

    公开(公告)号:US11883928B2

    公开(公告)日:2024-01-30

    申请号:US17322247

    申请日:2021-05-17

    IPC分类号: B24B9/00 B24B51/00

    CPC分类号: B24B9/00 B24B51/00

    摘要: A mechanism for polishing includes a polishing member, an eccentric member coupled to the polishing member, and a driving member coupled to the eccentric member. The driving member drives the eccentric member to rotate to move the polishing member to reciprocate in the one-dimensional direction, so that when a relative position between the polishing mechanism and the workpiece is fixed, the polishing member polishes a workpiece by translating a polishing surface. A method for the polishing process, applied by a polishing device, is also disclosed. By using the polishing mechanism, the entirety of the polishable surface of the workpiece can be covered, and collapsed edges of the workpiece are avoided.