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公开(公告)号:US06620559B2
公开(公告)日:2003-09-16
申请号:US09967698
申请日:2001-09-28
申请人: Günther Czech , Wolfgang Henke , Carsten Fülber
发明人: Günther Czech , Wolfgang Henke , Carsten Fülber
IPC分类号: G03F900
CPC分类号: G03F1/34 , G03F7/2022
摘要: The photomask and the associated method of lithography and mask technique enable production of a regular configuration of resist dots or holes. At least one photomask is a phase mask. The method is useful for the production of magnetic memory components, in particular MRAM memories, having elliptically shaped magnetic memory elements of high density.
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公开(公告)号:US06686098B2
公开(公告)日:2004-02-03
申请号:US09729062
申请日:2000-12-04
IPC分类号: G03F900
CPC分类号: B82Y10/00 , B82Y40/00 , G03F1/24 , G03F1/26 , G03F1/30 , G03F1/32 , G03F7/2004 , G03F7/70033 , G03F7/70233 , G03F7/70283 , G03F7/70575
摘要: Layers are patterned with a lithography method during the fabrication of integrated circuits. A mask, which may be reflective or transmissive, for carrying out the method. The photosensitive layers are exposed to radiation that is emitted by a radiation source. The radiation lies in the extreme ultraviolet region and is guided via the mask onto the photosensitive layers.
摘要翻译: 在集成电路制造过程中,利用光刻方法对层进行图案化。 可以是反射或透射的用于执行该方法的掩模。 感光层暴露于由辐射源发射的辐射。 辐射位于极紫外区域,并通过掩模引导到感光层上。
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