METHODS AND PLANTS FOR LOCATING POINTS ON COMPLEX SURFACES

    公开(公告)号:US20210255117A1

    公开(公告)日:2021-08-19

    申请号:US17251750

    申请日:2019-06-11

    Applicant: GEICO S.p.A.

    Abstract: A method for localizing defects on a complex surface of an object may include: realizing an acquisition assembly with an electromagnetic wave emission device and an optoelectronic device for detecting electromagnetic waves reflected by the complex surface; defining a scan path at a distance from the complex surface; and during a defect search procedure: moving the acquisition assembly along the path; defining instants during the moving of the acquisition assembly at which the acquisition assembly acquires an image of the complex surface as a two-dimensional pixel matrix of the optoelectronic device; storing consecutive two-dimensional pixel matrices obtained along the path; storing coordinates of the acquisition assembly along the scan path and associating the coordinates with respective two-dimensional matrices of the consecutive two-dimensional pixel matrices; locating detects in the consecutive two-dimensional pixel matrices; and/or determining spatial coordinates of the defects detected in the matrix using a linear or linearizable transformation.

Patent Agency Ranking