Abstract:
Apparatus for soldering electrical leads to terminals of a magnetic core and coil assembly by providing means for moving the core and coil assembly past a flow of solder to solder the leads and terminals. Predetermined lengths of leads are held in place adjacent to terminal pads on the assembly as the terminals and leads are wetted by providing means for causing at least the ends of the leads to traverse the crest of a cascade of solder. The point of intersection of a lead, a terminal, and a cascade of solder is called a soldering site. The direction of the solder flow is controlled so that solder will not contact the core and coil. A rail of a conveyer both supports the terminal pads and gauges the length of lead inserted in the terminals. The conveyor includes a trough along which the free ends of the leads may slide. The conveyor moves the assembly along a solder emitting orifice. As the terminals traverse the orifice at least the ends of the leads contact the flow of solder to wet the ends of the leads and adjacent portions of the terminals with molten solder.