Abstract:
An improvement to a wire welding method is disclosed in which a wire and a base plate, or a pair of wires, are welded together using a laser beam, and to a wire fixing jig employed in the method. The wire welding method includes the steps of bending an end portion of the base plate to form a bent portion in such a manner that the height of at least a portion of the bent portion is 1.0 to 3.0 times the diameter of the wire, abutting the wire against the bent portion, and directing a laser beam to a junction between the bent portion of the base plate and the wire such that the wire is welded to the base plate. The wire fixing jig includes a base portion, and a pair of holding arms extending from the base portion in a lateral direction and separated from each other by a predetermined distance. Each of the holding arms has a retaining pawl at a distal end for retaining the wire.
Abstract:
An ultrasonic welder is provided which comprises a base, a transducer, a tip, an anvil, a gathering tool, and an actuator for moving both the anvil and gathering tool. The anvil has angled sidewalls to improve weld efficiency.
Abstract:
A connecting board to be interposed between a base plate and a mounting board for bonding or joining them together is provided. A connecting board has a heating wire disposed inside a substrate thereof, a plurality of soft metal bodies which are easily deformable, and a first solder layer and a second solder layer formed on a first surface side protruded portion and a second surface side protruded portion of each of the soft metal bodies. By energizing the heating wire and melting the first and second solder layers, the connecting board can be bonded on a first surface side of the substrate to the base plate and on a second surface side of the substrate to the mounting board all at once. By energizing the heating wire, the base plate and/or mounting board can be separated from the connecting board with ease.
Abstract:
Portable electric wire cutter device includes a housing; a pair of spaced apart electrodes mounted with the housing; a source of electric current, for communication with the electrodes; a wire-guiding member, which can control or guide wire to be in proximity or contact with the electrodes; and a trigger mechanism, which can draw a wire within control of the wire-guiding member to electrical contact with the electrodes and activate a flow of electrical current from the source of electrical current to and from the electrodes, through a length of the wire in the electrical contact with the electrodes, such that the wire can be cut by the electrical current. The device may be of the hand-held type.
Abstract:
A metallurgical bond which may be substituted for a soldering process forms an alloy of a metal with a metal coating applied to at least one of the surfaces to be so bonded by a transient liquid phase (TLP) reaction at a low temperature. Mechanically robust bonding of noble metals for electrical connections which are resistively stable through repeated thermal cycling can be performed at particularly low temperatures using coating materials of indium, tin or lead. Isotropically or anisotropically conductive connections can be formed by applying a polymer adhesive containing conductive particles to at least one of the surfaces to be bonded and a compressional force developed between surface by curing of the polymer adhesive at temperatures lower than the melting point of a eutectic alloy of the chosen metal system before the TLP process is allowed to proceed.
Abstract:
A method of making a high reliability electrical connection in an implantable medical device. The electrical conductors may include metals such as niobium, molybdenum, tantalum, platinum, titanium, nickel and alloys thereof. The electrical conductors are resistance welded by establishing contact between the conductor pair, providing a protective atmosphere around the contacting pair, and applying electrical energy to the contacting pair to cause fusion while maintaining the protective atmosphere.
Abstract:
A method for bonding a solder wire is provided wherein a lower ball end of a material solder wire is first bonded to a first bonding portion of a workpiece. Then, the material solder wire is thermally cut to provide a solder wire segment held bonded to the first bonding portion and having an upper ball end. Finally, the upper ball end is bonded to a second bonding portion of the workpiece. All of the wire bonding process steps are performed in an oxygen-free atmosphere to prevent oxidation of the solder wire.
Abstract:
A method of joining transformer winding conductor cables is disclosed. The ends of the conductor cables to be joined are first chamfered to both clean and taper the respective ends. The tapered ends are then overlapped and pressed together. Vibratory energy is then applied to at least one of the overlapped ends to weld the cleaned conductor cable ends together to form a joint that has substantially the same cross sectional area as the conductor cables themselves.
Abstract:
Apparatus for soldering the winding of armatures of electrical machines to the collectors thereof. The apparatus includes a device for gripping, displacing and fixing the armature with the collector, a single-phase magnetic-hydrodynamic pump with metal conduit and a bath with molten solder and heaters. The magnetic core of the single-phase magnetic-hydrodynamic pump is embraced by a metal conduit disposed underneath the bottom of the bath, and the inlet of the metal conduit is connected to the bottom of the bath, while its outlet end is rigidly connected to a casing fastened to the bottom of the bath. To the bottom of the casing there is pressed by means of an easily releasable joint a changeable nozzle unit. When it is necessary to solder a collector with a diameter different from the previous one, the changeable nozzle unit is taken out of the apparatus and new one of a size corresponding to that of the collector to be soldered is inserted in the apparatus.
Abstract:
A fine wire welding machine for cold butt welding small diameter wires through a multiple upset technique. The machine includes a loading mechanism for accurately positioning the fine wire strands for subsequent engagement with the welding dies and the welding dies are movable in a plane parallel to their abutting faces for shearing the wires and aligning the end of the wire from one spool with the end of the wire from another spool for the subsequent welding technique. An improved operating mechanism is incorporated for operating the die actuating V-blocks and for operating the dies and gripping means in a predetermined sequence. The operating mechanism includes means for adjusting the opening of the dies and for permitting retraction of the dies for the loading procedure.