COMPOSITE COMPONENTS AND METHODS OF REDEFINING OPENINGS IN COMPOSITE COMPONENTS

    公开(公告)号:US20230147009A1

    公开(公告)日:2023-05-11

    申请号:US17521032

    申请日:2021-11-08

    CPC classification number: B28B17/0009

    Abstract: A method of redefining an opening in a composite component comprises filling the opening with a filling material, where the opening is defined in a body of the composite component and opens onto a surface defined by the composite component, and redefining the opening such that the opening extends into the body. Some methods comprise removing an existing coating from the surface of the composite component prior to filling the opening with the filling material and applying a new coating to the surface prior to redefining the opening such that the opening extends through the new coating and into the body. An exemplary composite component comprises a body, a surface with a coating thereon, an original opening defined through the body and filled with a filling material, and a new opening defined through the coating into the body, which may be defined at a new location from the original opening.

    SYSTEMS AND METHODS OF AUTOMATIC FILM REMOVAL

    公开(公告)号:US20250128444A1

    公开(公告)日:2025-04-24

    申请号:US18491887

    申请日:2023-10-23

    Abstract: A backing film removal system comprises a separating mechanism configured to separate a first portion of a first backing film on a first side of a material segment and a second portion of a second backing film on a second side of the material segment from a material layer of the material segment, wherein the second side is opposite the first side. The backing film removal system also includes a clamping mechanism that is actuatable to apply a clamping force to secure the material layer and the second portion together. A separator assembly includes a gripping mechanism configured to grip the first portion. At least one of the gripping mechanism or the clamping mechanism is movable to draw the first portion gripped by the gripping mechanism away from the material layer to remove a remaining portion of the first backing film from the material layer.

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