-
公开(公告)号：US10549478B2
公开(公告)日：2020-02-04
申请号：US15041973
申请日：2016-02-11
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Eliezer Manuel Alcantara Marte , Zachary David Fieldman , Thomas Sinnett , Daniel Joerger , Neal Dunham , Mike Miller
Abstract: The present disclosure generally relates to methods for additive manufacturing (AM) that utilize support surrounding structures in the process of building objects, as well as novel surrounding support structures to be used within these AM processes. The support structure surrounds at least a portion of the object with a continuous thickness of powder disposed between the support structure and the object, the continuous thickness of powder having a maximum thickness that does not exceed 10 mm.
-
公开(公告)号：US20170232682A1
公开(公告)日：2017-08-17
申请号：US15041973
申请日：2016-02-11
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Eliezer Manuel ALCANTARA MARTE , Zachary David Fieldman , Thomas Sinnett , Daniel Joerger , Neal Dunham , Mike Miller
IPC: B29C67/00
CPC classification number: B29C64/40 , B22F3/1055 , B22F2003/1058 , B29L2031/00 , B33Y10/00 , B33Y40/00 , Y02P10/295
Abstract: The present disclosure generally relates to methods for additive manufacturing (AM) that utilize support surrounding structures in the process of building objects, as well as novel surrounding support structures to be used within these AM processes. The support structure surrounds at least a portion of the object with a continuous thickness of powder disposed between the support structure and the object, the continuous thickness of powder having a maximum thickness that does not exceed 10 mm.
-
Search Results
2
records
(took 0.013 seconds)
