SYSTEM AND METHOD FOR MONITORING WAFER HANDLING AND A WAFER HANDLING MACHINE
    2.
    发明申请
    SYSTEM AND METHOD FOR MONITORING WAFER HANDLING AND A WAFER HANDLING MACHINE 有权
    用于监控水处理和水处理机的系统和方法

    公开(公告)号:US20140324208A1

    公开(公告)日:2014-10-30

    申请号:US13872734

    申请日:2013-04-29

    Abstract: Systems, machines, and methods for monitoring wafer handling are disclosed herein. A system for monitoring wafer handling includes a sensor and a controller. The sensor is capable of being secured to an assembled wafer handling machine. The controller is in electronic communication with the sensor and includes control logic. The control logic is configured to store a reference output of the sensor when the wafer handling machine is aligned and is configured to generate an indication signal when a difference between the reference output and a current output of the sensor exceeds a threshold.

    Abstract translation: 本文公开了用于监测晶片处理的系统,机器和方法。 用于监测晶片处理的系统包括传感器和控制器。 传感器能够固定在组装的晶片处理机上。 控制器与传感器进行电子通信,并包括控制逻辑。 所述控制逻辑被配置为当所述晶片处理机对准时存储所述传感器的参考输出,并且当所述参考输出与所述传感器的当前输出之间的差异超过阈值时被配置为产生指示信号。

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