公开(公告)号：US20180122689A1

公开(公告)日：2018-05-03

申请号：US15856525

申请日：2017-12-28

Applicant: GLOBALFOUNDRIES INC.

Inventor： James W. ADKISSON ,  Anthony K. STAMPER

IPC: H01L21/768 ,  H01L21/02 ,  H01L29/423 ,  H01L21/8249

CPC classification number: H01L21/76814 ,  H01L21/02063 ,  H01L21/8249 ,  H01L23/485 ,  H01L27/0623 ,  H01L29/0821 ,  H01L29/1004 ,  H01L29/42304 ,  H01L29/66272 ,  H01L29/66318 ,  H01L29/732 ,  H01L29/7371 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An advanced contact module for optimizing emitter and contact resistance and methods of manufacture are disclosed. The method includes forming a first contact via to a first portion of a first device. The method further includes filling the first contact via with metal material to form a first metal contact to the first portion of the first device. The method further includes forming additional contact vias to other portions of the first device and contacts of a second device. The method further includes cleaning the additional contact vias while protecting the first metal contact of the first portion of the first device. The method further includes filling the additional contact vias with metal material to form additional metal contacts to the other portions of the first device and the second device.