公开(公告)号：US10411752B1

公开(公告)日：2019-09-10

申请号：US16174145

申请日：2018-10-29

Applicant: GLOBALFOUNDRIES INC.

Inventor： Saquib Bin Halim ,  MD Sayed Kaysar Bin Rahim ,  Marcel Wieland

IPC: H04B1/38 ,  H04B1/40 ,  H01L23/31 ,  H01L23/48 ,  H01L23/552 ,  H01L21/56 ,  H01L21/768 ,  H01L23/66

Abstract: A semiconductor device comprising an on-mold antenna for transmitting and/or receiving a millimeter-wave radio frequency signal is provided. The semiconductor device includes a semiconductor layer; a polymer layer proximal to the semiconductor layer; a mold proximal to the polymer layer; a plurality of nodes proximal to the semiconductor layer and distal to the polymer layer; an antenna disposed on the mold; and a conductive element providing electrical communication between the antenna and a first node. The mold may be from 500 μm to 1000 μm thick, such as from 750 μm to 800 μm thick, such as about 775 μm.