公开(公告)号：US20190109029A1

公开(公告)日：2019-04-11

申请号：US15726359

申请日：2017-10-05

Applicant: GLOBALFOUNDRIES INC.

Inventor： Eyup Cinar ,  Robert Boyd Finlay ,  Patrick Leonard Minton

IPC: H01L21/67 ,  H01L21/02 ,  G05B13/02 ,  H01L21/66 ,  G05B19/418

Abstract: At least one method, apparatus and system disclosed herein involves performing a wafer to wafer feedback control of process performed on a semiconductor substrate. A first process on a first semiconductor wafer of a run of semiconductor wafers is performed using a processing tool. A first gas analysis of a gas in the processing tool is performed upon performing the first process. Determining a process feedback adjustment based upon a result of the first gas analysis. Data relating to the process feedback adjustment is provided. Performing a second process on a second semiconductor wafer based on the data relating to the process feedback adjustment.