公开(公告)号：US10388617B2

公开(公告)日：2019-08-20

申请号：US15793130

申请日：2017-10-25

Applicant: GLOBALFOUNDRIES INC.

Inventor： Erdem Kaltalioglu ,  Ping-Chuan Wang ,  Ronald Gene Filippi, Jr.

IPC: H01L23/00 ,  H01L23/48 ,  H01L21/308 ,  H01L21/60

Abstract: The present disclosure relates generally to flip chip technology and more particularly, to a method for fabricating a mechanically anchored controlled collapse chip connection (C4) pad on a semiconductor structure and a structure formed thereby. In an embodiment, a method is disclosed that includes forming a C4 pad on a patterned dielectric layer having grooves therein, the grooves providing an interfacial surface area between the patterned dielectric layer and the C4 pad sufficient to inhibit the C4 pad from delaminating during thermal expansion or contraction.