公开(公告)号：US09314861B2

公开(公告)日：2016-04-19

申请号：US14286015

申请日：2014-05-23

Applicant: GLOBALFOUNDRIES INC.

Inventor： Xiaowei Huang ,  Ke Pu ,  WeiFeng Zhang ,  Shou De Zhen

IPC: B23K37/04 ,  B23K1/00 ,  B23K3/08 ,  H05K3/22 ,  H05K3/30

CPC classification number: B23K1/0016 ,  B23K3/08 ,  B23K37/04 ,  H05K3/225 ,  H05K3/308 ,  H05K2201/09572 ,  H05K2203/0195 ,  H05K2203/1581 ,  H05K2203/176

Abstract: A temperature triggering ejector system for lock pin soldering type component is provided. There is provided a temperature triggering ejector system for a lock pin soldering type component, lock pins of said component are fixed in through holes of a circuit board and solder is filled in the through holes after soldering, said system comprising: an ejector that is located at one side of the circuit board that is opposed to said component, and has ejector pins aligned with the through holes of the circuit board and a cylinder that drives the ejector pins; a temperature sensor for sensing the temperature of said solder being heated; a controller for driving the ejector pins of the ejector within a solder melting temperature range based on the temperature sensed by the temperature sensor, to eject the lock pins of said component from said circuit board.

Abstract translation: 提供了一种用于锁定针焊接型组件的温度触发喷射器系统。 提供了一种用于锁销焊接型部件的温度触发喷射器系统，所述部件的锁定销固定在电路板的通孔中，并且在焊接之后焊料填充在通孔中，所述系统包括：位于 在电路板的与所述部件相对的一侧，并且具有与电路板的通孔对准的顶针和驱动顶针的气缸; 温度传感器，用于感测被加热的所述焊料的温度; 控制器，用于基于由温度传感器感测的温度在焊料熔化温度范围内驱动喷射器的顶针，以将所述部件的锁定销从所述电路板中排出。