公开(公告)号：US10181915B1

公开(公告)日：2019-01-15

申请号：US16006028

申请日：2018-06-12

Applicant: GLOBALFOUNDRIES INC.

Inventor： Mustapha Slamani ,  Timothy M. Platt ,  Thomas Moon

IPC: H04B3/46 ,  H04B17/29

Abstract: A local oscillator signal is output from a local oscillator using a reference signal produced by a reference signal generator. Similarly, a test intermediate frequency signal is output from a source oscillator using the reference signal. The test intermediate frequency signal is converted to a test radio frequency signal, with an up-converter using the local oscillator signal. The test radio frequency signal is supplied to a device under test, and an output radio frequency signal is received back from the device under test. The output radio frequency signal is converted to an output intermediate frequency signal, with a down-converter using the local oscillator signal. The output intermediate frequency signal is converted to a digital output signal, with a synchronized digitizer using the reference signal. Different phase signals of the output intermediate frequency signal are captured using the synchronized digitizer as the device under test is operated during a testing cycle.

公开(公告)号：US20200049737A1

公开(公告)日：2020-02-13

申请号：US16100297

申请日：2018-08-10

Applicant: GLOBALFOUNDRIES INC.

Inventor： Ye Wang ,  Hanyi Ding ,  Timothy M. Platt

IPC: G01R1/073 ,  G01R1/067

Abstract: Embodiments of the disclosure provide a probe structured for electrical and photonics testing of a photonic integrated circuit (PIC) die, the probe including: a membrane having a first surface and an opposing second surface and including conductive traces, the membrane being configured for electrical coupling to a probe interface board (PIB); a set of probe tips positioned on the membrane, the set of probe tips being configured to send electrical test signals to the PIC die or receive electrical test signals from the PIC die; and a photonic test assembly disposed on the membrane and electrically coupled to the conductive traces of the membrane, the photonic test assembly positioned for substantial alignment with a photonic I/O element of the PIC die, wherein the photonic test assembly is configured to transmit a photonic input signal to the photonic I/O element or detect a photonic output signal from the photonic I/O element.