公开(公告)号：US20190129390A1

公开(公告)日：2019-05-02

申请号：US15795431

申请日：2017-10-27

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Richard P. Good ,  Dirk Gleitsmann ,  Daniel Zschaebitz

IPC: G05B19/418

Abstract: Methods according to the disclosure include: identifying at least one non-candidate tool which previously processed at least one prior semiconductor wafer, and represented in a set of historical data, the set of historical data including manufacturing settings for performing an operation on the at least one prior semiconductor wafer, and a candidate tool which has not previously performed the operation on at least one prior semiconductor wafer, the candidate tool not being represented in the set of historical data; determining whether the set of historical data predicts the performing of the operation with the candidate tool based on the manufacturing settings for performing the operation on the at least one prior semiconductor wafer; and in response to the set of historical data predicting the performing of the operation with the candidate tool, selecting a manufacturing setting for the candidate tool based on the set of historical data.

公开(公告)号：US10481592B2

公开(公告)日：2019-11-19

申请号：US15795431

申请日：2017-10-27

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Richard P. Good ,  Dirk Gleitsmann ,  Daniel Zschaebitz

IPC: G05B19/418

Abstract: Methods according to the disclosure include: identifying at least one non-candidate tool which previously processed at least one prior semiconductor wafer, and represented in a set of historical data, the set of historical data including manufacturing settings for performing an operation on the at least one prior semiconductor wafer, and a candidate tool which has not previously performed the operation on at least one prior semiconductor wafer, the candidate tool not being represented in the set of historical data; determining whether the set of historical data predicts the performing of the operation with the candidate tool based on the manufacturing settings for performing the operation on the at least one prior semiconductor wafer; and in response to the set of historical data predicting the performing of the operation with the candidate tool, selecting a manufacturing setting for the candidate tool based on the set of historical data.