公开(公告)号：US10256204B2

公开(公告)日：2019-04-09

申请号：US15345608

申请日：2016-11-08

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Glen E Richard ,  Stephen P Ayotte ,  Hanyi Ding

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/34

Abstract: Embodiments of the present disclosure relate to separating an integrated circuit (IC) structure from an adjacent chip. An IC structure according to embodiments of the disclosure may include: a semiconductor region including an interconnect pad positioned thereon, the interconnect pad electrically connected to a solder bump; and an ohmic heating wire positioned within the semiconductor region and in thermal communication with the interconnect pad, wherein the ohmic heating wire is configured to be heated above a melting temperature of the solder bump.