公开(公告)号：US10224262B2

公开(公告)日：2019-03-05

申请号：US15593969

申请日：2017-05-12

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Kathryn C. Rivera ,  Janak G. Patel ,  David Stone ,  Samantha Donovan

IPC: H01L23/36 ,  H01L23/367 ,  H01L23/552 ,  H01L23/00

Abstract: Heat spreader lids and package assemblies including a heat spreader lid. The heat spreader lid has a central region configured to be coupled with an electronic component, a peripheral region configured to be coupled with a substrate, and a connecting region arranged between the central region and the peripheral region. The connecting region is configured to impart stress relief to the central region.

公开(公告)号：US20180331011A1

公开(公告)日：2018-11-15

申请号：US15593969

申请日：2017-05-12

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Kathryn C. Rivera ,  Janak G. Patel ,  David Stone ,  Samantha Donovan

IPC: H01L23/367 ,  H01L23/552 ,  H01L23/00

CPC classification number: H01L23/3675 ,  H01L23/36 ,  H01L23/552 ,  H01L23/562

Abstract: Heat spreader lids and package assemblies including a heat spreader lid. The heat spreader lid has a central region configured to be coupled with an electronic component, a peripheral region configured to be coupled with a substrate, and a connecting region arranged between the central region and the peripheral region. The connecting region is configured to impart stress relief to the central region.