公开(公告)号：US20180315707A1

公开(公告)日：2018-11-01

申请号：US15498083

申请日：2017-04-26

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Robert J. Fox, III ,  Kevin M. Boyd ,  Nicholas A. Polomoff ,  Roderick A. Augur ,  Jeannine M. Trewhella

IPC: H01L23/528 ,  H01L23/522 ,  H01L23/00

CPC classification number: H01L23/5283 ,  H01L23/5226 ,  H01L23/562

Abstract: A crack stop structure for an integrated circuit (IC) structure is disclosed. The structure can include: a first crack stop pillar laterally separated from a second crack stop pillar within an insulator region of the IC structure. The first crack stop pillar can include an overlapping via in contact with a top surface and at least one side surface of a first conductive element therebelow. The overlapping via of the first crack stop pillar may be in a given layer of the IC structure, and the second crack stop pillar may include a via in the given layer, the via extending to a different depth than the overlapping via. The via of the second crack stop pillar may be an overlapping via in contact with a top surface and at least one side surface of a second conductive element therebelow.

公开(公告)号：US10153232B2

公开(公告)日：2018-12-11

申请号：US15498083

申请日：2017-04-26

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Robert J. Fox, III ,  Kevin M. Boyd ,  Nicholas A. Polomoff ,  Roderick A. Augur ,  Jeannine M. Trewhella

IPC: H01L23/52 ,  H01L23/528 ,  H01L23/522 ,  H01L23/00

Abstract: A crack stop structure for an integrated circuit (IC) structure is disclosed. The structure can include: a first crack stop pillar laterally separated from a second crack stop pillar within an insulator region of the IC structure. The first crack stop pillar can include an overlapping via in contact with a top surface and at least one side surface of a first conductive element therebelow. The overlapping via of the first crack stop pillar may be in a given layer of the IC structure, and the second crack stop pillar may include a via in the given layer, the via extending to a different depth than the overlapping via. The via of the second crack stop pillar may be an overlapping via in contact with a top surface and at least one side surface of a second conductive element therebelow.