公开(公告)号：US20220216148A1

公开(公告)日：2022-07-07

申请号：US17702255

申请日：2022-03-23

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Il Goo KIM ,  Roderick A. AUGUR

IPC: H01L23/522 ,  H01L21/768 ,  H01L27/24 ,  H01L27/22

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to top electrode interconnect structures and methods of manufacture. The structure includes: a lower metallization feature; an upper metallization feature; a bottom electrode in direct contact with the lower metallization feature; one or more switching materials over the bottom electrode; a top electrode over the one or more switching materials; and a self-aligned via interconnection in contact with the top electrode and the upper metallization feature.