公开(公告)号：US11011303B2

公开(公告)日：2021-05-18

申请号：US16106162

申请日：2018-08-21

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Tung-Hsing Lee ,  Roderick A Augur ,  Siva R K Dangeti ,  Alexander L. Martin ,  Anvitha Shampur

IPC: H01F5/00 ,  H01F27/34 ,  H01L49/02 ,  H01F27/28 ,  H01F41/04 ,  H01F41/12 ,  H01F27/32

Abstract: A dummy fill element for positioning inside an active inductor component of an integrated circuit (IC), the inductor component, the IC and a related method, are disclosed. The active inductor component is configured to convert electrical energy into magnetic energy to reduce parasitic capacitance in an IC. The dummy fill element includes: a first conductive incomplete loop having a first end and a second end, and a second conductive incomplete loop having a first end and a second end. First ends of the first and second conductive incomplete loops are electrically connected, and the second ends of the first and second conductive incomplete loops are electrically connected. In this manner, eddy currents created in each conductive incomplete loop by the magnetic energy cancel at least a portion of each other, allowing for a desired metal fill density and maintaining the inductor's Q-factor.