公开(公告)号：US10114062B2

公开(公告)日：2018-10-30

申请号：US15266213

申请日：2016-09-15

Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

Inventor： Evan J. Dawley ,  Edgar P. Calderon ,  Cammi L. Siu ,  Lance W. Turner

IPC: G01R31/00 ,  G01R31/04 ,  G01N3/34 ,  G01N3/36 ,  G01R31/36 ,  G01N3/30

Abstract: A method and a test fixture for evaluating a junction between an electrical lead trace and a busbar are described, and include an electric power supply disposed to supply electric power to the electrical lead trace and an electric monitoring device disposed to monitor electrical potential across the junction. A mechanical stress-inducing device is disposed to apply mechanical stress proximal to the junction. The electric monitoring device monitors the electrical potential across the junction of the electrical lead trace coincident with the mechanical stress-inducing device applying mechanical stress proximal to the junction when the electric power supply is supplying electric power to the electrical lead trace. Electrical integrity of the junction is evaluated based upon the monitored electrical potential across the junction.

公开(公告)号：US20170322251A1

公开(公告)日：2017-11-09

申请号：US15266213

申请日：2016-09-15

Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

Inventor： Evan J. Dawley ,  Edgar P. Calderon ,  Cammi L. Siu ,  Lance W. Turner

IPC: G01R31/04 ,  G01N3/34 ,  G01N3/36 ,  G01R31/36

CPC classification number: G01R31/046 ,  G01N3/30 ,  G01N3/34 ,  G01N3/36 ,  G01N2203/0039 ,  G01N2203/0617 ,  G01R31/3644 ,  G01R31/44

Abstract: A method and a test fixture for evaluating a junction between an electrical lead trace and a busbar are described, and include an electric power supply disposed to supply electric power to the electrical lead trace and an electric monitoring device disposed to monitor electrical potential across the junction. A mechanical stress-inducing device is disposed to apply mechanical stress proximal to the junction. The electric monitoring device monitors the electrical potential across the junction of the electrical lead trace coincident with the mechanical stress-inducing device applying mechanical stress proximal to the junction when the electric power supply is supplying electric power to the electrical lead trace. Electrical integrity of the junction is evaluated based upon the monitored electrical potential across the junction.