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公开(公告)号:US12123583B1
公开(公告)日:2024-10-22
申请号:US18488892
申请日:2023-10-17
IPC分类号: F21V29/87 , F21K9/69 , F21V5/00 , F21W104/00 , F21Y115/10
CPC分类号: F21V29/87 , F21K9/69 , F21V5/004 , F21W2104/00 , F21Y2115/10
摘要: A microLED lighting module is disclosed. The microLED lighting module includes a micromodule having one or more transparent polymer layers thereon. Additionally, the one or more transparent polymer lavers are configured to maintain a temperature of the microLED lighting module below approximately 220° C.
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2.
公开(公告)号:US20240264480A1
公开(公告)日:2024-08-08
申请号:US18163668
申请日:2023-02-02
IPC分类号: G02F1/1333 , B60R13/10 , G02F1/167 , G02F1/16753 , H05K7/20
CPC分类号: G02F1/133385 , B60R13/10 , G02F1/133331 , G02F1/167 , G02F1/16753 , H05K7/20963 , B29C45/14 , B29K2995/0026 , B29L2031/7232
摘要: A body component for a transportation vehicle comprising an e-paper visible from a front side of the body component; a thermally protective material at least partially surrounding the e-paper; an injection molded body element located around at least a portion of the thermally protective film can be used on a transportation device to provide a digital image.
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