公开(公告)号：US20240348966A1

公开(公告)日：2024-10-17

申请号：US18681642

申请日：2021-09-28

Applicant: GN AUDIO A/S

Inventor： Frank LIN ,  Felix CARLSSON ,  Mikael COLLIN ,  Lars KRISTENSEN ,  Jon Grane MADSEN ,  Bill ZENG ,  Zongyi ZHAO

IPC: H04R1/10

CPC classification number: H04R1/105 ,  H04R1/1008

Abstract: A headband for a headset is disclosed. The headband is configured to carry at least one earcup of the headset. The headband comprises a carrier and a foam padding. The carrier is curved to conform to a wearer's head and has a central carrier region. The foam padding is coupled to the carrier and configured to abut the wearer's head when the headband is worn by the wearer. The foam padding has a uniform shape and defines a central foam region arranged at the central carrier region and a peripheral foam region arranged outside of the central carrier region. The foam padding in the central foam region has a lower hardness than the foam padding in the peripheral foam region.

公开(公告)号：US20230053043A1

公开(公告)日：2023-02-16

申请号：US17818694

申请日：2022-08-09

Applicant: GN Audio A/S

Inventor： Jon Grane MADSEN ,  Jack ZHAO ,  Bill ZENG ,  Frank ZHANG

IPC: H04R1/10

Abstract: The disclosure relates to on-ear headphones comprising at least one ear-cushion, the at least one ear-cushion defining an ear-surface configured to interface with a user's ear when the headphones are worn by the user, the ear-surface comprising a perforated area, the perforated area comprising a plurality of staggered elongated perforations.

公开(公告)号：US20230066274A1

公开(公告)日：2023-03-02

申请号：US18047540

申请日：2022-10-18

Applicant: GN Audio A/S

Inventor： Frank LIN ,  Seven HUANG ,  Alice LIN ,  Jon Grane MADSEN ,  Bill ZENG

IPC: H04R5/033

Abstract: A headband for a headset and a method for producing the headband for the headset is disclosed. The headband is configured to carry at least one earcup of the headset. The headband comprises a carrier and a rubber suspension formed by overmolding. The method comprising the steps of providing the carrier, arranging the carrier in an injection molding tool, and forming the suspension from a rubber material by overmolding such that the suspension forms at least two attachment points to the carrier.

公开(公告)号：US20220210560A1

公开(公告)日：2022-06-30

申请号：US17454401

申请日：2021-11-10

Applicant: GN Audio A/S

Inventor： Frank LIN ,  Seven HUANG ,  Alice LIN ,  Jon Grane MADSEN ,  Bill ZENG

IPC: H04R5/033

Abstract: A headband for a headset and a method for producing the headband for the headset is disclosed. The headband is configured to carry at least one earcup of the headset. The headband comprises a carrier and a rubber suspension formed by overmolding. The method comprising the steps of providing the carrier, arranging the carrier in an injection molding tool, and forming the suspension from a rubber material by overmolding such that the suspension forms at least two attachment points to the carrier.