公开(公告)号：US20230269903A1

公开(公告)日：2023-08-24

申请号：US18003926

申请日：2020-10-24

Applicant: GOERTEK INC.

Inventor： Tao QIU ,  Xiangjun ZHANG ,  Tiecun WANG ,  Wenjie LIU

IPC: H05K7/20 ,  G02B27/01 ,  G01K1/024 ,  G01P1/02

CPC classification number: H05K7/20154 ,  G02B27/017 ,  G01K1/024 ,  G01P1/026 ,  H05K7/20209

Abstract: Disclosed is a heat dissipation method for a head-mounted device. A temperature sensor, a heat dissipation fan and a power supply are disposed in the head-mounted device. The heat dissipation method for a head-mounted device comprises: obtaining a temperature acquired by the temperature sensor and an electric quantity of the power supply periodically or in real time; and activating the heat dissipation fan when it is determined that the head-mounted device satisfies a heat dissipation condition according to the temperature and the electric quantity. Further disclosed are a head-mounted device and a computer-readable storage medium. By means of the present disclosure, heat dissipation can be performed on a head-mounted device in a timely manner, thereby ensuring the service life of the head-mounted device.