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公开(公告)号:US12132128B2
公开(公告)日:2024-10-29
申请号:US18517160
申请日:2023-11-22
发明人: Kairui Lin , Chaohua Zhang
IPC分类号: H01L31/0236 , H01L31/02 , H01L31/0224 , H01L31/077 , H01L31/18
CPC分类号: H01L31/02366 , H01L31/0201 , H01L31/022441 , H01L31/022475 , H01L31/077 , H01L31/188 , H01L31/1888
摘要: A back-contact cell with isolation grooves specifically disposed and a preparation method thereof. The back-contact cell includes: a silicon substrate having, on a back side, a polished region and a textured region disposed alternately along an X-axis direction of the back side, a first semiconductor layer disposed on the polished region, and a second semiconductor layer disposed on the textured region. The back-contact cell further includes a conductive film layer and a conductive mask layer sequentially disposed outwardly along a Z-axis direction of the back side. A conductive composite layer formed by the conductive mask layer and the conductive film layer is provided with isolation grooves disposed at intervals along the X-axis direction. The isolation groove is located above a contact interface between the first semiconductor layer and the second semiconductor layer in the Z-axis direction, and the isolation groove spans part of the polished region and part of the textured region in the X-axis direction.