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公开(公告)号:US20180095507A1
公开(公告)日:2018-04-05
申请号:US15284903
申请日:2016-10-04
Applicant: GOOGLE INC.
Inventor: William Riis HAMBURGEN , Joshua Norman LILJE , James COOPER
CPC classification number: G06F1/20 , G06F1/203 , H05K7/20336
Abstract: Techniques of managing heat within an electronic device involve providing a vapor chamber in a ring shape within an electronic device. In some implementations, the vapor chamber forms an outer case wall of an enclosure of the electronic device. In further implementations, the vapor chamber has a fill port attached to the inner edge of the vapor chamber. Advantageously, by using a vapor chamber with a ring geometry in an electronic device according to the improved techniques, a form factor of the electronic device (e.g., a laptop, a tablet, etc.) is not affected by the introduction of the vapor chamber as an outer case wall.
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公开(公告)号:US20170220074A1
公开(公告)日:2017-08-03
申请号:US15010125
申请日:2016-01-29
Applicant: GOOGLE INC.
Inventor: James COOPER , Joshua Norman LILJE
CPC classification number: G06F1/1658 , H05K3/321 , H05K9/0022 , H05K9/0032
Abstract: An electronic device may include a printed circuit board (PCB) including at least one electronic component, and an electrically conductive enclosure surrounding the at least one electronic component to provide electromagnetic interference (EMI) shielding for the at least one component. The electrically conductive enclosure may include a frame, made of a resilient, electrically conductive material, on a mounting surface of the PCB, surrounding the at least one component, and an electrically conductive shielding cover extending across an open top area defined by the frame. The frame may be attached to the PCB and the cover by an electrically conductive material to provide for electrical continuity. The frame may be made of a resilient, electrically conductive material so that the frame may compress in response to an externally applied force, and may return to an original, non-compressed form upon removal of the externally applied force.
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