公开(公告)号：US5239200A

公开(公告)日：1993-08-24

申请号：US748004

申请日：1991-08-21

申请人： Gaetano P. Messina ,  Robert A. Brewster ,  Theodore J. Kara ,  Seaho Song

发明人： Gaetano P. Messina ,  Robert A. Brewster ,  Theodore J. Kara ,  Seaho Song

IPC分类号： H01L23/473

CPC分类号： H01L23/473 ,  F28F13/06 ,  F28F3/12 ,  H01L2224/16

摘要： An apparatus for cooling an array of integrated circuit chips mounted on a substrate comprises a thermally conductive cooling plate which has a plurality of integral, substantially parallel, closed-end channels. A cover which may be made of plastic is adapted to seal the periphery of the cooling member and is spaced from the channel-containing surface. The cover has a plurality of integral baffles extending toward the cooling member into and along the length of the channels. The baffles and the channels are spaced from each other to permit passage of a coolant between and through the channels in a flow direction normal to the channels. An inlet and outlet for the coolant are provided on opposite ends of the apparatus, and may be located in the cover. In an alternate embodiment, the cooling plate contains at least two sets of the channels, each set of channels receiving a separate flow of coolant, either in parallel or in series with each other.

摘要翻译： 用于冷却安装在基板上的集成电路芯片的阵列的装置包括具有多个整体的，基本上平行的封闭端通道的导热冷却板。 可以由塑料制成的盖适于密封冷却构件的周边并且与通道容纳表面间隔开。 盖具有多个整体挡板，其朝向冷却构件延伸并沿着通道的长度延伸。 挡板和通道彼此间隔开，以允许冷却剂在垂直于通道的流动方向上通过通道。 用于冷却剂的入口和出口设置在设备的相对端上，并且可以位于盖中。 在替代实施例中，冷却板包含至少两组通道，每组通道接收单独的冷却剂流，或者彼此平行或串联。