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公开(公告)号：US07914332B2
公开(公告)日：2011-03-29
申请号：US12549865
申请日：2009-08-28
IPC分类号： H01R24/00
CPC分类号： G02B6/3897 , G02B6/3817 , H05K7/1454 , Y10T29/49826
摘要： Electronic circuit card mounting assemblies and methods are disclosed. An electronic circuit card and an electronic equipment system include mating connectors to operatively couple the circuit card to the equipment system. The circuit card and the equipment system also include respective mating elements of a mounting assembly that engage each other to releasably mount the electronic circuit card to the electronic equipment system. The connectors and the elements of the mounting assembly are positioned to releasably hold the connectors in an operative position when the circuit card is mounted to the equipment system. Related methods of manufacturing electronic circuit cards and equipment systems are also provided. In one embodiment, the mounting assembly elements include a key and a socket to receive the key, and the key and the socket control one or more of a circuit card insertion force, a circuit card retention force, and a circuit removal force.
摘要翻译： 公开了电子电路卡安装组件和方法。 电子电路卡和电子设备系统包括配对连接器以将电路卡可操作地耦合到设备系统。 电路卡和设备系统还包括安装组件的相互匹配的元件，其彼此接合以将电子电路卡可释放地安装到电子设备系统。 当电路卡安装到设备系统时，安装组件的连接器和元件被定位成将连接器可释放地保持在操作位置。 还提供了制造电子电路卡和设备系统的相关方法。 在一个实施例中，安装组件元件包括钥匙和用于接收钥匙的插座，钥匙和插座控制电路卡插入力，电路卡保持力和电路去除力中的一个或多个。
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公开(公告)号：US08376032B2
公开(公告)日：2013-02-19
申请号：US11588199
申请日：2006-10-24
申请人： Seaho Song , Jesse Jaejin Kim
发明人： Seaho Song , Jesse Jaejin Kim
CPC分类号： H01L23/427 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： A heat sink includes a first housing adapted to receive a coolant in a first phase; one or more fins stacked on the first housing, the one or more fins having openings there-through to receive a second phase of the coolant; and a second housing coupled to the one or more fins to define an internal chamber.
摘要翻译： 散热器包括适于在第一相中接收冷却剂的第一壳体; 一个或多个翅片堆叠在第一壳体上，所述一个或多个翅片在其上具有开口以接收冷却剂的第二相; 以及联接到所述一个或多个翅片以限定内部腔室的第二壳体。
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公开(公告)号：US20110053423A1
公开(公告)日：2011-03-03
申请号：US12549865
申请日：2009-08-28
CPC分类号： G02B6/3897 , G02B6/3817 , H05K7/1454 , Y10T29/49826
摘要： Electronic circuit card mounting assemblies and methods are disclosed. An electronic circuit card and an electronic equipment system include mating connectors to operatively couple the circuit card to the equipment system. The circuit card and the equipment system also include respective mating elements of a mounting assembly that engage each other to releasably mount the electronic circuit card to the electronic equipment system. The connectors and the elements of the mounting assembly are positioned to releasably hold the connectors in an operative position when the circuit card is mounted to the equipment system. Related methods of manufacturing electronic circuit cards and equipment systems are also provided. In one embodiment, the mounting assembly elements include a key and a socket to receive the key, and the key and the socket control one or more of a circuit card insertion force, a circuit card retention force, and a circuit removal force.
摘要翻译： 公开了电子电路卡安装组件和方法。 电子电路卡和电子设备系统包括配对连接器以将电路卡可操作地耦合到设备系统。 电路卡和设备系统还包括安装组件的相互匹配的元件，其彼此接合以将电子电路卡可释放地安装到电子设备系统。 当电路卡安装到设备系统时，安装组件的连接器和元件被定位成将连接器可释放地保持在操作位置。 还提供了制造电子电路卡和设备系统的相关方法。 在一个实施例中，安装组件元件包括钥匙和用于接收钥匙的插座，钥匙和插座控制电路卡插入力，电路卡保持力和电路去除力中的一个或多个。
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4.发明授权
公开(公告)号：US5884486A
公开(公告)日：1999-03-23
申请号：US878796
申请日：1997-06-19
CPC分类号： H05K5/0213 , F25B21/02 , F24F2003/144 , F24F5/0042 , F25B2321/0251 , F25D21/14 , F25D2321/142
摘要： The invention relates to apparatus and method for efficiently removing humidity from a chamber. A thermoelectric cooler with a maintained temperature differential between the cool and warm sides of the cooler is used to condense the humidity from within the chamber upon the cool side of the cooler. The condensate is transferred to the warm side of the cooler and then removed through the capillary penetration into a porous structure of an evaporator at the warm side of the cooler and further evaporation. During evaporation, the condensate extracts heat from the warm side of the cooler, the temperature of the cool side of the cooler being also decreased, which results in an increase of the overall efficiency of the apparatus.
摘要翻译： 本发明涉及一种有效地从室中去除湿度的装置和方法。 在冷却器的冷却和冷却侧之间具有保持的温度差的热电冷却器用于在冷却器的冷却侧将来自室内的湿度冷凝。 冷凝物被转移到冷却器的温暖的一侧，然后通过毛细管穿透被除去在冷却器的温暖侧的蒸发器的多孔结构中并进一步蒸发。 在蒸发期间，冷凝物从冷却器的暖侧提取热量，冷却器的冷却侧的温度也降低，这导致设备的整体效率的提高。
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公开(公告)号：US5239200A
公开(公告)日：1993-08-24
申请号：US748004
申请日：1991-08-21
IPC分类号： H01L23/473
CPC分类号： H01L23/473 , F28F13/06 , F28F3/12 , H01L2224/16
摘要： An apparatus for cooling an array of integrated circuit chips mounted on a substrate comprises a thermally conductive cooling plate which has a plurality of integral, substantially parallel, closed-end channels. A cover which may be made of plastic is adapted to seal the periphery of the cooling member and is spaced from the channel-containing surface. The cover has a plurality of integral baffles extending toward the cooling member into and along the length of the channels. The baffles and the channels are spaced from each other to permit passage of a coolant between and through the channels in a flow direction normal to the channels. An inlet and outlet for the coolant are provided on opposite ends of the apparatus, and may be located in the cover. In an alternate embodiment, the cooling plate contains at least two sets of the channels, each set of channels receiving a separate flow of coolant, either in parallel or in series with each other.
摘要翻译： 用于冷却安装在基板上的集成电路芯片的阵列的装置包括具有多个整体的，基本上平行的封闭端通道的导热冷却板。 可以由塑料制成的盖适于密封冷却构件的周边并且与通道容纳表面间隔开。 盖具有多个整体挡板，其朝向冷却构件延伸并沿着通道的长度延伸。 挡板和通道彼此间隔开，以允许冷却剂在垂直于通道的流动方向上通过通道。 用于冷却剂的入口和出口设置在设备的相对端上，并且可以位于盖中。 在替代实施例中，冷却板包含至少两组通道，每组通道接收单独的冷却剂流，或者彼此平行或串联。
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公开(公告)号：US20080093053A1
公开(公告)日：2008-04-24
申请号：US11588199
申请日：2006-10-24
申请人： Seaho Song , Jesse Jaejin Kim
发明人： Seaho Song , Jesse Jaejin Kim
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： A heat sink includes a first housing adapted to receive a coolant in a first phase; one or more fins stacked on the first housing, the one or more fins having openings there-through to receive a second phase of the coolant; and a second housing coupled to the one or more fins to define an internal chamber.
摘要翻译： 散热器包括适于在第一相中接收冷却剂的第一壳体; 一个或多个翅片堆叠在第一壳体上，所述一个或多个翅片在其上具有开口以接收冷却剂的第二相; 以及联接到所述一个或多个翅片以限定内部腔室的第二壳体。
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公开(公告)号：US5865332A
公开(公告)日：1999-02-02
申请号：US66590
申请日：1998-04-27
CPC分类号： G02B6/3897
摘要： An environmental protection housing for an optical fiber connector having two housing parts to define an environmentally protected chamber to house the connector. The housing is for use for housing a connector upon suspended cable. So as to prevent the weight of the cable being taken by the connector when the housing parts are separated, a movement limiting device is provided an which extends between the housing members. This movement limiting device comprises an elongate rigid member which is capable of preventing relative rotation or change in relative orientation of the housing parts while the rigid member extends between the housing parts. With the connector uncoupled and thus the danger of the loading of the cable being taken upon the connector in coupled condition, the connector is releasable from one or both of the housing parts.
摘要翻译： 一种用于光纤连接器的环境保护壳体，具有两个壳体部分，以限定用于容纳连接器的环境保护室。 外壳用于在悬挂电缆上容纳连接器。 为了防止当壳体部件分离时由连接器取出电缆的重量，提供了一种在壳体部件之间延伸的移动限制装置。 该移动限制装置包括细长的刚性构件，其能够在刚性构件在壳体部件之间延伸时能够防止壳体部件的相对定向的相对旋转或变化。 由于连接器不连接，因此在连接状态下将电缆装载在连接器上的危险，连接器可从外壳部件中的一个或两个部件释放。
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8.发明授权
公开(公告)号：US5294830A
公开(公告)日：1994-03-15
申请号：US703614
申请日：1991-05-21
IPC分类号： H01L23/433 , H01L23/473 , H01L23/02 , H01L25/04
CPC分类号： H01L23/4735 , H01L23/4338 , H01L2224/16225 , H01L2924/15312
摘要： An integrated circuit thermal conduction module comprises a substrate having a chip-carrying surface and at least one integrated circuit chip on the substrate. A deformable, liquid-impermeable, thermally conductive film or foil extends over an upper surface of the chip. A piston has a lower surface which urges and conforms the film against the chip upper surface and which contains at least one open channel permitting coolant passage and contact with the film for conveying heat from the chip without direct contact between the coolant and chip. Preferably, the piston has a central passageway extending along the longitudinal axis for channeling the coolant through the piston, and has a plurality of channels extending radially outwardly from the central passageway along the lower face for directing coolant beneath the piston.
摘要翻译： 集成电路热传导模块包括具有芯片承载表面的衬底和在衬底上的至少一个集成电路芯片。 可变形的液体不可渗透的导热膜或箔在芯片的上表面上延伸。 活塞具有下表面，该下表面促使薄膜抵靠芯片上表面，并且其包含至少一个敞开的通道，允许冷却剂通过并与薄膜接触，用于从芯片传送热量，而不会直接接触冷却剂和芯片。 优选地，活塞具有沿着纵向轴线延伸的中心通道，用于将冷却剂引导通过活塞，并且具有沿着下表面从中心通道径向向外延伸的多个通道，用于将冷却剂引导到活塞下方。
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