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公开(公告)号：US10794700B1
公开(公告)日：2020-10-06
申请号：US15337681
申请日：2016-10-28
IPC分类号： G01C19/5684 , G01C25/00
摘要： To isolate an active portion of a gyroscope resonator from mounting stresses propagating through a resonator attachment center, the resonator includes a stress isolation feature that includes alternating concentric symmetric regions of high and low stiffness. The resonator may be separated into a large number of thin, compliant spring elements and larger stiff mass elements, the aggregate areas of which optimized for an aggregate resonator spring constant (by selecting a width and a length of the spring elements), an aggregate mass (by selecting a size of the mass elements), a thermoelastic loss maximum (by selecting a width of the spring elements) and an operating frequency (by selecting a ratio of the aggregate spring to the aggregate mass).
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公开(公告)号：US10551190B1
公开(公告)日：2020-02-04
申请号：US15337627
申请日：2016-10-28
IPC分类号： G01C19/5684
摘要： A resonator paradigm, where the resonator structure is made up of a very large number of small, coupled Coriolis sensitive units arranged in a periodic 1D or 2D (and, possibly, in the future, 3D) structure to create a Coriolis-sensitive “fabric” that supports a large number of Coriolis-coupled “supermodes. Such a “fabric” can be shaped into arbitrary “waveguides” that propagate either pulses of excitation that are Coriolis-coupled, thus enabling an acoustic version of a FOG-type gyroscope (where a pulse of excitation travels along a passive waveguide and it's phase/time delay is measured), or support multiple “stationary” Coriolis-coupled vibration modes analogous to optical laser modes in an RLG where counter-propagating modes of oscillation are maintained at constant amplitude via a continuous addition of energy.
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公开(公告)号：US10352960B1
公开(公告)日：2019-07-16
申请号：US15337572
申请日：2016-10-28
IPC分类号： G01P15/13 , G01P15/125 , G01P15/08
摘要： A MEMS accelerometer incorporating a metrology element to directly measure minute changes in measurement baseline. In particular, the MEMS accelerometer incorporates a metrology bar (MB). Embodiments also relate to stress isolation into the sensor design to isolate the sensitive areas of the chip (i.e., the metrology baseline and the proof mass mounting points) from outside stress.
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公开(公告)号：US10907965B2
公开(公告)日：2021-02-02
申请号：US16553785
申请日：2019-08-28
IPC分类号： G01C19/5684
摘要： A resonator paradigm, where the resonator structure is made up of a very large number of small, coupled Coriolis sensitive units arranged in a periodic 1D or 2D (and, possibly, in the future, 3D) structure to create a Coriolis-sensitive fabric that supports a large number of Coriolis-coupled supermodes. Such a fabric can be shaped into arbitrary waveguides that propagate either pulses of excitation that are Coriolis-coupled, thus enabling an acoustic version of a FOG-type gyroscope (where a pulse of excitation travels along a passive waveguide and it's phase/time delay is measured), or support multiple stationary Coriolis-coupled vibration modes analogous to optical laser modes in an RLG where counter-propagating modes of oscillation are maintained at constant amplitude via a continuous addition of energy.
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公开(公告)号：US20200018599A1
公开(公告)日：2020-01-16
申请号：US16553785
申请日：2019-08-28
IPC分类号： G01C19/5684
摘要： A resonator paradigm, where the resonator structure is made up of a very large number of small, coupled Coriolis sensitive units arranged in a periodic 1D or 2D (and, possibly, in the future, 3D) structure to create a Coriolis-sensitive “fabric” that supports a large number of Coriolis-coupled “supermodes. Such a “fabric” can be shaped into arbitrary “waveguides” that propagate either pulses of excitation that are Coriolis-coupled, thus enabling an acoustic version of a FOG-type gyroscope (where a pulse of excitation travels along a passive waveguide and it's phase/time delay is measured), or support multiple “stationary” Coriolis-coupled vibration modes analogous to optical laser modes in an RLG where counter-propagating modes of oscillation are maintained at constant amplitude via a continuous addition of energy.
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公开(公告)号：US10278281B1
公开(公告)日：2019-04-30
申请号：US15337436
申请日：2016-10-28
摘要： A MEMS thermal stress isolation system is disclosed. The MEMs thermal stress isolation system is a MEMS embedded hardware implementation designed to isolate the sensitive sensor die from external stresses caused by rigid attachment to packaging and to allow the sensor to perform with improved immunity to the negative impacts of rigid sensor packaging attachment. A planar, micro-etched interface structure is integrated into the MEMS wafer stack, which serves as the mechanical connection between the MEMS sensor and the external packaging.
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