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公开(公告)号:US5763320A
公开(公告)日:1998-06-09
申请号:US570070
申请日:1995-12-11
IPC分类号: H01L31/0288 , H01L31/0352 , H01L31/18 , H01L21/22
CPC分类号: H01L31/035281 , H01L31/0288 , H01L31/1804 , Y02E10/547 , Y02P70/521
摘要: A method (10,30) of boron doping a semiconductor particle using boric acid to obtain a p-type doped particle. Either silicon spheres or silicon powder is mixed with a diluted solution of boric acid having a predetermined concentration. The spheres are dried (16), with the boron film then being driven (18) into the sphere. A melt procedure mixes the driven boron uniformly throughout the sphere. In the case of silicon powder, the powder is metered out (38) into piles and melted/fused (40) with an optical furnace. Both processes obtain a p-type doped silicon sphere with desired resistivity. Boric acid is not a restricted chemical, is inexpensive, and does not pose any special shipping, handling, or disposal requirements.
摘要翻译: 使用硼酸掺杂半导体颗粒以获得p型掺杂颗粒的方法(10,30)。 将硅球或硅粉末与预定浓度的硼酸稀释溶液混合。 将球体干燥(16),然后硼膜被驱动(18)进入球体。 熔融程序将驱动的硼在整个球体中均匀混合。 在硅粉的情况下,将粉末计量(38)成堆并用光学炉熔化(40)。 两种工艺获得具有所需电阻率的p型掺杂硅球体。 硼酸不是限制性化学品,价格便宜,并不构成任何特殊的运输,处理或处置要求。