AUTOMATED ULTRASONIC INSPECTION OF ADHESIVELY-BONDED JOINTS AND INSPECTION METHOD THEREFOR

    公开(公告)号:US20180231502A1

    公开(公告)日:2018-08-16

    申请号:US15893977

    申请日:2018-02-12

    Abstract: An inspection system for determining the efficacy and veracity of a bond-line, comprising: a robotic arm assembly providing a gimbal mount for enabling linear and rotary translation about multiple axes; an ultrasonic transducer affixed to the gimbal mount of the robotic arm assembly and comprising a planar array of transducer elements, each transducer element capable of transmitting and receiving reflected ultrasonic energy indicative of changes in acoustic impedance within the bond-line. The reflected energy of each transducer element provides acquired bond-line data indicative of the efficacy of the bond-line while select transducer elements produce orientation data indicative of the orientation of the planar array relative to the contour of the bonded joint. The bond-line and orientation data are combined to determine whether the direction of the transmitted pulse should be altered to validate the bond-line data.

    Automated ultrasonic inspection of adhesively-bonded joints and inspection method therefor

    公开(公告)号:US10782268B2

    公开(公告)日:2020-09-22

    申请号:US15893977

    申请日:2018-02-12

    Abstract: An inspection system for determining the efficacy and veracity of a bond-line, comprising: a robotic arm assembly providing a gimbal mount for enabling linear and rotary translation about multiple axes; an ultrasonic transducer affixed to the gimbal mount of the robotic arm assembly and comprising a planar array of transducer elements, each transducer element capable of transmitting and receiving reflected ultrasonic energy indicative of changes in acoustic impedance within the bond-line. The reflected energy of each transducer element provides acquired bond-line data indicative of the efficacy of the bond-line while select transducer elements produce orientation data indicative of the orientation of the planar array relative to the contour of the bonded joint. The bond-line and orientation data are combined to determine whether the direction of the transmitted pulse should be altered to validate the bond-line data.

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