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公开(公告)号：US20230304879A1
公开(公告)日：2023-09-28
申请号：US17702596
申请日：2022-03-23
Applicant: General Electric Company
Inventor： Robert James MacDonald , Yizhen Lin , Nicholas G. Yost , David Richard Esler
CPC classification number: G01L5/173 , B81B7/0019 , B81C1/00817 , B81B2201/0292 , B81C2203/033
Abstract: A sensing element having improved temperature and pressure characteristics including at least one acoustic sensing device formed mainly from a silicon substrate and having a microelectromechanical system without the use of quartz or polymer, wherein the at least one acoustic sensing device detects a torque associated with a metal object subject to said torque, and a high temperature bonding surface for directly connecting the sensing element to the metal object via a high temperature connecting processes comprising at least one of soldering, metalizing and/or brazing, without the need for a polymer adhesive. Related sensors using such sensing elements and methods are also disclosed herein.
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公开(公告)号：US20250076135A1
公开(公告)日：2025-03-06
申请号：US18953254
申请日：2024-11-20
Applicant: General Electric Company
Inventor： Robert James MacDonald , Yizhen Lin , Nicholas G. Yost , David Richard Esler
Abstract: An apparatus includes a first acoustic sensing resonator formed from a silicon substrate and has a first microelectromechanical system. The apparatus also includes a second acoustic sensing resonator formed from the silicon substrate and has a second microelectromechanical system. The second acoustic sensing resonator is arranged on the silicon substrate at a ninety degree (90°) angle with respect to the first acoustic sensing resonator and together the first acoustic sensing resonator and second acoustic sensing resonator form a torque sensor. A high temperature bonding surface is connected to the torque sensor for directly connecting the torque sensor to a metal object.
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