公开(公告)号：US20200370197A1

公开(公告)日：2020-11-26

申请号：US16967947

申请日：2019-02-08

Applicant: General Electric Company

Inventor： Sheng Xu ,  Yanfei Gu ,  Dalong Zhong

IPC: C25D13/12 ,  C23C28/00 ,  F01D5/28 ,  C23C4/02 ,  B05B12/26

Abstract: The present invention relates to a method of processing a component, wherein the component comprises at least one opening in a surface thereof, the method comprising: placing the component in an electrophoretic fluid comprising particles of a masking material as an electrode, applying a voltage to the component and a counter electrode of the component, depositing particles of the masking material in the electrophoretic fluid into the at least one aperture through electrophoresis to mask the at least one aperture; processing a surface of the component; and removing the masking material in the at least one opening.

公开(公告)号：US11814742B2

公开(公告)日：2023-11-14

申请号：US16967947

申请日：2019-02-08

Applicant: General Electric Company

Inventor： Sheng Xu ,  Yanfei Gu ,  Dalong Zhong

IPC: C25D13/12 ,  C23C4/02 ,  F01D5/28 ,  C25D13/00 ,  C23C28/00

CPC classification number: C25D13/12 ,  C23C4/02 ,  C23C28/3215 ,  C25D13/00 ,  F01D5/288 ,  F05D2230/90

Abstract: The present invention relates to a method of processing a component, wherein the component comprises at least one opening in a surface thereof, the method comprising: placing the component in an electrophoretic fluid comprising particles of a masking material as an electrode, applying a voltage to the component and a counter electrode of the component, depositing particles of the masking material in the electrophoretic fluid into the at least one aperture through electrophoresis to mask the at least one aperture; processing a surface of the component; and removing the masking material in the at least one opening.