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公开(公告)号:US06254979B1
公开(公告)日:2001-07-03
申请号:US09089630
申请日:1998-06-03
申请人: George Albert Drew , Mark S. Ricketts , Bryan A. Gillispie , Yang-Tse Cheng , Robert A. Suchanek
发明人: George Albert Drew , Mark S. Ricketts , Bryan A. Gillispie , Yang-Tse Cheng , Robert A. Suchanek
IPC分类号: B32B516
CPC分类号: H01R13/03 , B32B15/01 , B32B15/013 , B32B15/018 , C25D7/00 , Y10S428/929 , Y10T428/12014 , Y10T428/12569 , Y10T428/25 , Y10T428/254 , Y10T428/256 , Y10T428/26 , Y10T428/269 , Y10T428/273
摘要: A low friction, low contact resistance coating for electrical terminal members, especially members made of copper base alloys and low carbon steel alloys and plastics, is formed of a coarse electroplate of tin or silver characterized by grains having an average dimension in the range of about 0.5 to 10 micrometers where such grains carry very small particles of polytetrafluoroethylene or the like having average diameters in the range up to about 0.30 micrometers.
摘要翻译: 用于电端子构件,特别是由铜基合金和低碳钢合金和塑料制成的构件的低摩擦,低接触电阻涂层由粗大的锡或银电镀层形成,其特征在于平均尺寸在约 0.5至10微米,其中这种晶粒携带非常小的聚四氟乙烯颗粒,其平均直径范围高达约0.30微米。