公开(公告)号：US4871899A

公开(公告)日：1989-10-03

申请号：US180631

申请日：1988-04-04

申请人： Gerald DuFrenne

发明人： Gerald DuFrenne

IPC分类号： B23K3/047

CPC分类号： B23K3/0471

摘要： An electrically heated thermode mounts to a support movable to position the thermode for multiple lead reflow soldering and includes a flat resistance element folded on its flat side in a U-shape structure in which the bight portion forms the pressing portion and the legs the terminal portions of the thermode. To overcome a problem arising where a group of joints to be soldered have varying height tops, the way in which the thermode is mounted to the movable support provides freedom of rotational movement of the thermode relative to the support while providing a low resistance electrical connection between support and the thermode terminal portions. To overcome a problem arising because opposite end joints sink more heat than interior joints, terminal plates are shaped and connected to the terminal portions so as to distribute a sheet of current in a way that more of the current flows along side edges than along the interior portion of the U-shaped structure.

摘要翻译： 电加热的热电偶安装到可移动以将多个引线回流焊接的热电偶定位的支撑件，并且包括在U形结构中折叠在其平坦侧上的平坦电阻元件，其中弯曲部分形成按压部分， 的热点。 为了克服在要焊接的一组接头具有不同的高度顶部时出现的问题，热电偶安装到可移动支撑件的方式提供了热源相对于支撑件的旋转运动的自由度，同时提供了在第 支架和热电极端子部分。 为了克服由于相对端部接头比内部接头吸收更多的热量而引起的问题，端子板被成形并连接到端子部分，以便以更多的电流沿着侧面沿着内部流动的方式分布电流片 部分为U形结构。