利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

80 条记录 (耗时 0.038 秒)

    Soldering tool
    1.
    发明授权
    Soldering tool 有权

    公开(公告)号：US09669481B1

    公开(公告)日：2017-06-06

    申请号：US14242862

    申请日：2014-04-01

    申请人： RAPTOR EQUIPMENT, LLC.

    发明人： Austin K. Schmitz

    IPC分类号： B23K3/03 ,  B23K1/00

    CPC分类号： B23K3/087 ,  B23K3/0471 ,  B23K2101/38

    摘要： The present disclosure comprises methods, apparatus, components, and techniques for soldering. A soldering tool includes opposing jaw pieces adapted to grip and/or compress work pieces while applying heat. The work pieces can be heated to a temperature at or above the melting point of a solder material, whereupon the solder may be melted and applied at the work pieces. The soldering tool may be removed from the work pieces, thereby allowing the solder to solidify and form a soldered joint. Soldering tools may be powered by portable, rechargeable, and/or detachable battery packs that are readily accessible and commonly used for a wide variety of hand-operated power tools.

    SEMICONDUCTOR BONDING APPARATUS
    3.
    发明申请
    SEMICONDUCTOR BONDING APPARATUS 审中-公开

    公开(公告)号：US20120248598A1

    公开(公告)日：2012-10-04

    申请号：US13423552

    申请日：2012-03-19

    申请人： Kuniaki Sueoka

    发明人： Kuniaki Sueoka

    IPC分类号： H01L23/498 ,  B23K3/04 ,  H01L21/66

    CPC分类号： B23K3/0471 ,  H01L2224/75252 ,  H01L2224/75315 ,  H01L2224/755 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/00

    摘要： An apparatus includes a tool head configured for bonding to establish 100 or more electrical and mechanical connections between a silicon chip having a thickness of about 50 microns (μm) or smaller and a substrate, wherein 100 or more solder bumps set on a plurality of contacts on the silicon chip or a plurality of contacts on the substrate are melted by heating between the plurality of contacts of the silicon chip and the substrate, and wherein the melted solder bumps are solidified by cooling using forced convection of air flowing from around the silicon chip. The tool head includes a pyrolytic graphite sheet configured to be used in direct contact with the silicon chip, and having a thickness between about 75 μm and 125 μm.

    Heating head for soldering and de-soldering of SMD components
    4.
    发明授权
    Heating head for soldering and de-soldering of SMD components 失效
    SMD组件焊接和脱焊用加热头

    公开(公告)号：US06761304B2

    公开(公告)日：2004-07-13

    申请号：US10006802

    申请日：2001-11-13

    申请人： Czeslaw A. Ruszowski

    发明人： Czeslaw A. Ruszowski

    IPC分类号： B23K3100

    CPC分类号： B23K3/0471 ,  B23K1/018 ,  B23K3/047

    摘要： A heating head for soldering and de-soldering surface mount devices (SMD's) using hot inert gas or air is comprised of a handle in which there is placed a heater sub-assembly on which there is secured a quick connect mechanism for mounting a heating nozzle. The heater sub-assembly is enclosed in a shroud and is secured to the end of the handle by a thermal insulating ring, such shroud housing a ceramic rod having elongated bosses on which a heating element is secured, while a laminar flow equilizer is used to provide more uniform gas flow across the heating element. Quick connect mechanism is secured to the heater sub-assembly shroud and uses a spring loaded winged locking mechanism to the secure heating nozzles to the heater head. In one embodiment, the heating nozzles have a truncated pyramid shaped chamber to which individual end nozzles are attached for directing gas flow.

    摘要翻译： 用于使用热惰性气体或空气焊接和脱焊表面贴装器件（SMD）的加热头包括手柄，其中放置有加热器子组件，其上固定有用于安装加热喷嘴的快速连接机构 。 加热器子组件被封装在护罩中并且通过绝热环固定到手柄的端部，这种护罩容纳具有细长凸起的陶瓷棒，在其上固定有加热元件，而使用层流平衡器 在加热元件上提供更均匀的气流。 快速连接机构被固定到加热器子组件护罩上，并且使用弹簧加载的有翼的锁定机构到加热器头部的安全加热喷嘴。 在一个实施例中，加热喷嘴具有截头棱锥形的腔室，各个端部喷嘴连接到其上以引导气体流动。

    Reflow soldering self-aligning fixture
    5.
    发明授权
    Reflow soldering self-aligning fixture 失效
    回流焊自调整夹具

    公开(公告)号：US6047875A

    公开(公告)日：2000-04-11

    申请号：US710784

    申请日：1996-09-20

    申请人： Talal M. Al-Nabulsi

    发明人： Talal M. Al-Nabulsi

    IPC分类号： B23K1/00 ,  B23K3/047 ,  B23K3/08 ,  H05K3/34 ,  H05K3/36 ,  B23K37/04

    CPC分类号： B23K3/087 ,  B23K1/0004 ,  B23K3/0471 ,  B23K2201/42 ,  H05K3/3405 ,  H05K3/3494 ,  H05K3/363 ,  Y10S269/902 ,  Y10S269/903

    摘要： An improvement in a reflow soldering apparatus for bonding a connector element such as flexible circuitry or a pin type input/output (I/O) connector to a printed circuit board (PCB) is disclosed wherein a fixture tray included in the apparatus automatically aligns or self levels itself with the heating bars, or thermodes, of the apparatus. The fixture tray includes a body for supporting the connector/PCB assembly and cylindrical rods extending from the body. The rods are rotatably supported in corresponding grooves on the surface of the fixture tray table. As a thermode is pressed onto the connector/PCB assembly, the fixture tray rotates about its axis of rotation until the work area is aligned with the thermode. In a sandwich type soldering application including a pair of thermodes for simultaneously soldering opposite sides of a connector/PCB assembly, the fixture tray rests on an upper plate of a tray table supported by resilient means such as springs. Pressing an upper thermode onto the upper work surface of the connector/PCB assembly causes the work surface to rotate into alignment with the thermodes, and further causes the upper plate to descend until the bottom work surface of the connector/PCB assembly contacts the lower thermode prior to initiation of a reflow soldering cycle.

    摘要翻译： 公开了一种用于将诸如柔性电路或引脚型输入/输出（I / O）连接器的连接器元件接合到印刷电路板（PCB）的回流焊接装置的改进，其中包括在装置中的固定托盘自动对准或 自身水平本身与设备的加热棒或热电偶。 夹具托盘包括用于支撑连接器/ PCB组件的本体和从主体延伸的圆柱形杆。 杆被可旋转地支撑在固定托盘台的表面上的对应凹槽中。 当热电偶被压在连接器/ PCB组件上时，固定托盘绕其旋转轴线旋转，直到工作区域与热电偶对准。 在包括用于同时焊接连接器/ PCB组件的相对侧的一对热电偶的夹层式焊接应用中，固定托盘搁置在由诸如弹簧的弹性装置支撑的托盘台的上板上。 将上部热电极压到连接器/ PCB组件的上部工作表面上，使工件表面旋转成与热电偶对准，并进一步使上板下降直到连接器/ PCB组件的底部工作表面接触下部热电偶 在开始回流焊接循环之前。

    Electrode for an electrically heated soldering head of a soldering machine
    6.
    发明授权
    Electrode for an electrically heated soldering head of a soldering machine 失效
    用于焊接机电加热焊接头的电极

    公开(公告)号：US4912743A

    公开(公告)日：1990-03-27

    申请号：US254437

    申请日：1988-10-06

    申请人： Viktor Zeltner

    发明人： Viktor Zeltner

    IPC分类号： H05B3/42 ,  B23K3/04 ,  B23K3/047 ,  H01R43/00 ,  H05K3/34

    CPC分类号： B23K3/0471 ,  H05K3/3421 ,  H05K3/3494

    摘要： An electrode for an electrically heated soldering head of a soldering machine comprises: a current-fed resistive element for generating heat; a contacting member for contacting an article being soldered; an insulating layer effective for coupling the current-fed resistive element and the contacting member to one another such that the element and the member are thermally connected but electrically insulated from one another; and electrical connecting wires so connected as to ensure that the electrical potential on the contacting member is about equal to the electrical potential of the article being soldered.

    摘要翻译： 一种用于焊接机的电加热焊接头的电极包括：用于产生热量的电流馈电电阻元件; 用于接触被焊接的物品的接触构件; 绝缘层，其有效地将电流馈送的电阻元件和接触构件彼此耦合，使得元件和构件彼此热连接但电绝缘; 和连接电气的电连接线，以确保接触构件上的电位大约等于被焊接物品的电位。

    Titiable electric thermode for multiple connection reflow soldering
    7.
    发明授权
    Titiable electric thermode for multiple connection reflow soldering 失效
    用于多次连接回流焊接的可定制电热管

    公开(公告)号：US4871899A

    公开(公告)日：1989-10-03

    申请号：US180631

    申请日：1988-04-04

    申请人： Gerald DuFrenne

    发明人： Gerald DuFrenne

    IPC分类号： B23K3/047

    CPC分类号： B23K3/0471

    摘要： An electrically heated thermode mounts to a support movable to position the thermode for multiple lead reflow soldering and includes a flat resistance element folded on its flat side in a U-shape structure in which the bight portion forms the pressing portion and the legs the terminal portions of the thermode. To overcome a problem arising where a group of joints to be soldered have varying height tops, the way in which the thermode is mounted to the movable support provides freedom of rotational movement of the thermode relative to the support while providing a low resistance electrical connection between support and the thermode terminal portions. To overcome a problem arising because opposite end joints sink more heat than interior joints, terminal plates are shaped and connected to the terminal portions so as to distribute a sheet of current in a way that more of the current flows along side edges than along the interior portion of the U-shaped structure.

    摘要翻译： 电加热的热电偶安装到可移动以将多个引线回流焊接的热电偶定位的支撑件，并且包括在U形结构中折叠在其平坦侧上的平坦电阻元件，其中弯曲部分形成按压部分， 的热点。 为了克服在要焊接的一组接头具有不同的高度顶部时出现的问题，热电偶安装到可移动支撑件的方式提供了热源相对于支撑件的旋转运动的自由度，同时提供了在第 支架和热电极端子部分。 为了克服由于相对端部接头比内部接头吸收更多的热量而引起的问题，端子板被成形并连接到端子部分，以便以更多的电流沿着侧面沿着内部流动的方式分布电流片 部分为U形结构。

    Micro-soldering tool
    8.
    发明授权
    Micro-soldering tool 失效
    微焊工具

    公开(公告)号：US4255644A

    公开(公告)日：1981-03-10

    申请号：US895791

    申请日：1978-04-12

    申请人： Raymond L. Delorme

    发明人： Raymond L. Delorme

    IPC分类号： H05K3/34 ,  B23K3/03 ,  B23K3/047 ,  B23K3/02 ,  H05B3/24 ,  H05K13/04

    CPC分类号： B23K3/0471

    摘要： A tool for micro-soldering the connecting tags of an integrated circuit chip to corresponding terminals on a substrate by Joule heating includes a high conductivity bit having a planar bottom face adapted to contact the tags and press them against the terminals while applying sufficient heat to the tags to solder them to the terminals. The face has a perimeter and a centrally apertured portion adapted to receive and accommodate the circuit chip. The apertured portion forms a geometric loop on the planar face having opposite sides spaced from each other and adapted to contact the tags of the chip. A continuous high electrical conductivity flange extends upwardly from all portions of the perimeter of the face to provide rigidity to the bit.A pair of high conductivity strips extend from facing segments of the flange for applying current to and removing current from the flange on opposite sides of the loop so that a pair of symmetrical current half loops extend about the face between the opposite sides thereof. Each strip has a reduced cross-sectional area symmetrical with the side of the face and removed from the intersection of the strip with the flange.

    摘要翻译： 用于通过焦耳加热将集成电路芯片的连接标签与基板上的相应端子微连接的工具包括具有适于接触标签的平坦底面的高电导率位，并将其压靠端子，同时向该端子施加足够的热量 标签将其焊接到端子。 该面具有适于容纳和容纳电路芯片的外围和中心有孔部分。 有孔部分在平面上形成几何环，其具有彼此间隔开的相对侧并且适于接触芯片的标签。 连续的高导电性凸缘从面的周边的所有部分向上延伸，以提供刚度。 一对高导电性带从法兰的面对部分延伸，用于向环路的相对侧上的法兰施加电流并从电路的相反侧除去电流，使得一对对称的电流半环围绕其相对侧面之间延伸。 每个条带具有减小的横截面面积，与面的侧面对称并且从条带与法兰的交叉处移开。