公开(公告)号：US08425738B2

公开(公告)日：2013-04-23

申请号：US12418130

申请日：2009-04-03

申请人： Gerd Hoffman ,  Alexandra L. Quiceno

发明人： Gerd Hoffman ,  Alexandra L. Quiceno

IPC分类号： C23C14/34

CPC分类号： C23C14/081 ,  C23C14/562 ,  Y10T428/31678

摘要： The present invention refers to a coating device for depositing of barrier layers on a plastic substrate comprising a first coating station for depositing a first layer comprising a metal and a second coating station for depositing a second layer comprising a resin, wherein a treatment station for treating the deposited first layer is arranged between the first and the second coating stations which comprises sputter means for depositing one or several atomic layers or isles of deposition material. The invention further refers to an appropriate method which can be carried out by the coating device and to a layer system produced thereby.

摘要翻译： 本发明涉及一种用于在塑料基板上沉积阻挡层的涂覆装置，包括用于沉积包括金属的第一层的第一涂覆站和用于沉积包含树脂的第二层的第二涂覆站，其中处理站用于处理 沉积的第一层布置在第一和第二涂覆站之间，其包括用于沉积一个或几个原子层或沉积材料岛的溅射装置。 本发明还涉及可以由涂布装置和由其制造的层系统执行的适当方法。

公开(公告)号：US20090324972A1

公开(公告)日：2009-12-31

申请号：US12418130

申请日：2009-04-03

申请人： Gerd Hoffman ,  Alexandra L. Quiceno

发明人： Gerd Hoffman ,  Alexandra L. Quiceno

IPC分类号： B32B15/04 ,  C23C14/34 ,  B32B9/04

CPC分类号： C23C14/081 ,  C23C14/562 ,  Y10T428/31678

摘要： The present invention refers to a coating device for depositing of barrier layers on a plastic substrate comprising a first coating station for depositing a first layer comprising a metal and a second coating station for depositing a second layer comprising a resin, wherein a treatment station for treating the deposited first layer is arranged between the first and the second coating stations which comprises sputter means for depositing one or several atomic layers or isles of deposition material. The invention further refers to an appropriate method which can be carried out by the coating device and to a layer system produced thereby.

摘要翻译： 本发明涉及一种用于在塑料基板上沉积阻挡层的涂覆装置，包括用于沉积包括金属的第一层的第一涂覆站和用于沉积包含树脂的第二层的第二涂覆站，其中处理站用于处理 沉积的第一层布置在第一和第二涂覆站之间，其包括用于沉积一个或几个原子层或沉积材料岛的溅射装置。 本发明还涉及可以由涂布装置和由其制造的层系统执行的适当方法。