公开(公告)号：US20220013966A1

公开(公告)日：2022-01-13

申请号：US17274463

申请日：2019-10-16

Applicant: GigaLane Co., Ltd.

Inventor： Hwa Yoon SONG ,  Sang Min SEO ,  Eun Jung KIM ,  Jin Uk LEE ,  Kyung Hun JUNG ,  Hee seok JUNG

IPC: H01R24/40 ,  H01R13/24 ,  H01R43/20 ,  H01R12/71 ,  H01R13/652

Abstract: The disclosed invention relates to a method of manufacturing a housing-integrated board mating connector, the method including: preparing a housing of an electrical device, the housing having a housing insertion hole formed therein and a part or the entirety of the housing being made of a conductive metal material; inserting a cylindrical ground gasket into the housing insertion hole; preparing a dielectric part and signal terminal part assembly in which a dielectric part surrounds a signal terminal part; and inserting the dielectric part and signal terminal part assembly into an inner circumferential surface of the ground gasket.