公开(公告)号：US20240194714A1

公开(公告)日：2024-06-13

申请号：US18064890

申请日：2022-12-12

申请人： GlobalFoundries Singapore Pte. Ltd.

发明人： Ping ZHENG ,  Eng Huat TOH ,  Cancan WU ,  Kiok Boone Elgin QUEK

IPC分类号： H01L27/146

CPC分类号： H01L27/1463 ,  H01L27/1462 ,  H01L27/14627 ,  H01L27/14683

摘要： A photodiode device includes a semiconductor substrate, a plurality of pixels, each of the pixels including a diode structure on a first side of the substrate and a conductive layer on a second side of the substrate, and DTI structures isolating adjacent pixels from one another, the DTI structures including a conductive material that electrically couples the conductive layer on the second side of the substrate and a metal line on the first side of the substrate. The conductive material in the DTI structures is part of an electrode circuit for the pixels.