公开(公告)号：US20250081397A1

公开(公告)日：2025-03-06

申请号：US18934562

申请日：2024-11-01

Applicant: Google LLC

Inventor： Eric Chuang ,  Victor Cheng ,  Cheng-Lin Wang

IPC: H05K7/20 ,  H04M1/02

Abstract: This document describes a vapor chamber within an electronic device. In aspects, an electronic device includes a middle frame that provides mechanical support for the electronic device, a middle plate affixed to the middle frame to define an inner layer of a chassis, and a vapor chamber disposed inside the middle plate. The vapor chamber includes a first region proximate to a heat source and a second region opposite the first region. A coolant is evaporated in a first mode at the first region by heat absorbed from the heat source and is condensed in a second mode in the second region. This vapor chamber permits cooling of elements within the electronic device at lower cost and/or smaller size than many conventional cooling systems.